多层互连印制电路板深微孔性能仿真分析  

Research on plating capability of multi-layer interconnect deep microvia PCB based on simulation model

作　　者：王康磊 宋伟伟 焦小山 WANG Kanglei;SONG Weiwei;JIAO Xiaoshan(Wuxi Shennan Circuit Co.,Ltd.,Wuxi 214412,Jiangsu,China)

机构地区：[1]无锡深南电路有限公司,江苏无锡214412

出　　处：《印制电路信息》2023年第3期11-17,共7页Printed Circuit Information

摘　　要：印制电路板(PCB)深微孔蟹脚及镀层结晶异常是PCB电镀过程中常见的缺陷,对其可靠性影响较大。采用有限元分析法,对侧喷时板面及孔内的镀液流动状态进行数值计算,得到不同喷流速度和不同厚径比时镀液在深微孔底部的流速分布数据。同时,通过试验研究电流密度、波形时间比、正反电流比等电镀参数对深微孔电镀效果的影响。结果表明:当电镀参数与喷流频率协同作用时,可有效改善PCB深微孔蟹脚和及镀层结晶异常类缺陷。Deep microporous crab legs and abnormal crystallization of coating are common defects in the electroplating process,which have a significant impact on the reliability of PCB products.The article uses the method of finite element analysis to numerically calculate the flow state of the plating solution on the PCB surface and in the hole during side spraying,and obtains the velocity distribution of the plating solution at the bottom of the deep microhole under different jet velocities and different thickness-to-diameter ratios data;In addition,the influence of electroplating parameters such as current density,waveform time ratio,positive and negative current ratio on the effect of deep microporous electroplating is studied through experiments.The results show that when electroplating and jet flow parameters are synergistic,these defects can be effectively improved.

关 键 词：深微孔印制板 电镀效果 结晶异常 有限元分析 

分 类 号：TN41[电子电信—微电子学与固体电子学]