多层线电阻精密印制板制作方法  

Research on the manufacturing method of wire resistance precision multilayer PCB

作　　者：万虎 盛龙 江旭 WAN Hu;SHENG Long;JIANG Xu(Guangde Mu Tai Lai Circuit Technology Co.,Ltd.,Xuancheng 242000,Anhui,China)

机构地区：[1]广德牧泰莱电路技术有限公司,安徽宣城242000

出　　处：《印制电路信息》2023年第3期56-62,共7页Printed Circuit Information

摘　　要：与常规线圈板相比,多层线电阻精密印制板的层数更高、线路更精细、体积更小,且电阻要求更复杂,因此其平面线圈的设计有较高难度。目前该类型产品已被广泛应用于射频识别(RFID)、微电机、军品、无线充电等领域。针对多层线电阻精密印制板,就其在生产中如何满足线路电阻控制要求及线宽线距的公差问题展开研究。Multi-layer wire resistance precision printed board has higher requirements than usually coil board such as higher layer number,finer lines,smaller volume,and more complex resistance requirement.The design of its plane coil also has certain difficulty.This type of products has been widely used in RFID radio frequency identification,micro motor,military defense,wireless charging,etc.This paper discusses how to meet the requirements of line resistance control and the tolerance of line width and line distance in the production.

关 键 词：多层线电阻 精密印制板 线圈板 电阻控制 

分 类 号：TN41[电子电信—微电子学与固体电子学]