基于HTCC的两相交错同步BUCK电路设计  

Design of Two-phase Interleaved Synchronous Buck Circuit Based on HTCC

作　　者：王贵刚 李雪 白玉新 闫宏宇 WANG Guigang;LI Xue;BAI Yuxin;YAN Hongyu(Aerospace Shentuo(Beijing)Technology Co.,Ltd.,Beijing,100176 China)

机构地区：[1]航天深拓(北京)科技有限公司,北京100176

出　　处：《科技创新导报》2022年第30期133-137,共5页Science and Technology Innovation Herald

摘　　要：为了解决旋转导向工具遇到的“卡脖子”问题,本文提出一种两相交错同步BUCK电路拓扑结构,能够产生更少的热量,在不需外加其他散热方式的情况下就能够适应200℃的工作环境;集成电路采用裸露管芯,元器件占用的体积更小,相邻元器件之间的距离更小;HTCC基板材料耐高温、易导热,互联线更细;产品的功率密度更高。电源模块封装于金属壳内,减少了人为因素的影响,可靠性提高,保证其在严酷的环境下长期稳定工作。In order to solve the"neck"problem encountered by the rotating guide tool,this paper proposes a two-phase interleaved synchronous BUCk circuit topology,which can produce less heat and adapt to the working environment of 200℃without adding other heat dissipation methods.The integrated circuit adopts bare die,the volume occupied by components is smaller,and the distance between adjacent components is smaller;HTCC substrate material is resistant to high temperature,easy to conduct heat,and the interconnection line is thinner.The power density of the product is higher.The power module is encapsulated in a metal shell,which reduces the influence of human factors,improves the reliability and ensures its long-term stable operation in a harsh environment.

关 键 词：两相交错同步BUCK 200℃ 裸露管芯 HTCC基板 

分 类 号：TN45[电子电信—微电子学与固体电子学]