陶瓷抛光废料制备UHPC的耐久性能试验研究  

Experimental Study on Durability of UHPC Prepared from Ceramic Polishing Waste

作　　者：李相国[1] 张乘 吕阳[1] 李树国 田博[1] 张成龙 柯凯 LI Xiangguo;ZHANG Cheng;LYU Yang;LI Shuguo;TIAN Bo;ZHANG Chenglong;KE Kai(State Key Laboratory of Silicate Materials for Architectures,Wuhan University of Technology,Wuhan 430070,China;School of Materials and Chemical Engineering,Hubei University of Technology,Wuhan 430070,China)

机构地区：[1]武汉理工大学硅酸盐建筑材料国家重点实验室,武汉430070 [2]湖北工业大学材料与化学工程学院,武汉430070

出　　处：《硅酸盐通报》2023年第4期1418-1427,共10页Bulletin of the Chinese Ceramic Society

基　　金：国家自然科学基金(51808420)。

摘　　要：为探究陶瓷抛光废料(CPW)对超高性能混凝土(UHPC)耐久性能的影响,采用CPW分别取代部分水泥、粉煤灰和硅灰制备UHPC,主要研究了CPW对UHPC孔隙结构、力学性能、体积稳定性、抗氯离子渗透性能以及抗硫酸盐侵蚀性能的影响。结果表明,随着CPW分别取代水泥、粉煤灰、硅灰量的增加,UHPC的孔隙率增大,导致UHPC的抗氯离子渗透性能下降。CPW取代粉煤灰会增大UHPC的自收缩,而取代水泥和硅灰会减小UHPC的自收缩。CPW取代水泥会降低UHPC的抗压强度,但对硫酸盐侵蚀后UHPC的抗蚀系数和抗压强度有所提升;当CPW取代20%(质量分数)的水泥时,硫酸盐侵蚀90 d的UHPC的抗压强度达到最高。In order to investigate the effect of ceramic polishing waste(CPW)on the durability of ultra-high performance concrete(UHPC),the CPW was used to replace part of cement,fly ash and silica fume to prepare UHPC,and the effect of CPW on the pore structure,mechanical properties,volume stability,chloride penetration resistance,and sulfate attack resistance of UHPC was investigated.The results show that the porosity of UHPC increases with the increase of CPW replacing cement,fly ash and silica fume,respectively,and then the chloride penetration resistance of UHPC decreases.The replacement of fly ash by CPW improves the autogenous shrinkage of UHPC,while the replacement of cement and silica fume by CPW leads to reduce the autogenous shrinkage of UHPC.The replacement of cement by CPW reduces the compressive strength of UHPC,but the corrosion resistance coefficient and compressive strength of UHPC are improved after sulfate attack.When the cement replacement rate by CPW is 20%(mass fraction),the compressive strength of UHPC after sulfate attack for 90 d reaches the highest value.

关 键 词：陶瓷抛光废料 超高性能混凝土 耐久性能 自收缩 干燥收缩 压汞法 

分 类 号：TU528[建筑科学—建筑技术科学]