面向电子应用的聚合物化学镀前表面处理技术  

Surface Pretreatment of Polymer Electroless Plating for Electronic Applications

作　　者：邬学贤 张岩 叶淳懿 张志彬 骆静利 符显珠 Xuexian Wu;Yan Zhang;Chunyi Ye;Zhibin Zhang;Jingli Luo;Xianzhu Fu(College of Materials Science and Engineering,Shenzhen University,Shenzhen 518055,China;Pingshan Biomedical R&D Transformation Center,Shenzhen Bay Laboratory,Shenzhen 518118,China)

机构地区：[1]深圳大学材料学院,深圳518055 [2]深圳湾实验室坪山生物医药研发转化中心,深圳518118

出　　处：《化学进展》2023年第2期233-246,共14页Progress in Chemistry

摘　　要：聚合物表面金属化在电子产品的导电互连、电磁屏蔽、导热散热、装饰保护等方面起着重要作用。与真空溅射等方法相比,化学镀是一种金属镀层均匀、低成本、易规模化生产、不需昂贵设备的聚合物表面金属化技术。近年来面向电子信息应用(如芯片制造、5G通信、柔性电子)的环氧树脂、聚酰亚胺(PI)、液晶聚合物(LCP)、聚四氟乙烯(PTFE)、聚二甲基硅氧烷(PDMS)、聚对苯二甲酸乙二酯(PET)、聚氨基甲酸酯(PU)、聚苯乙烯(PS)等聚合物化学镀技术得到积极研究。聚合物化学镀前表面处理,尤其是粗化和活化方法对于化学镀性能至关重要。粗化处理对镀层与基底的结合力、镀层对基底的完整包覆程度有明显影响;同时活化方法对化学镀的速度、镀层的厚度产生影响。在面向电子应用的聚合物化学镀前处理中,粗化过程如化学刻蚀、等离子体处理和接枝处理等,以及活化过程如离子吸附还原、催化剂直接吸附和墨水打印书写等也出现了许多新进展。本文对电子应用中各种聚合物基体化学镀前粗化和活化处理技术的最新进展进行了总结,旨在为应用于电子信息的化学镀新技术发展提供参考。Metallization of polymer surface plays an important role in conductive interconnect,electromagnetic shielding,thermal management,decoration and protection of electronic products.Compared with vacuum sputtering and other methods,electroless plating has advantages of uniform coating,low cost and easy large⁃scale production.In recent years,polymer used for electronic applications such as epoxy resin,polyimide(PI),liquid crystal polymer(LCP),polytetrafluoroethylene(PTFE),polydimethylsiloxane(PDMS),polyethylene terephthalate(PET),polyurethane(PU),polystyrene(PS)have been actively studied.Coarsening treatment has obvious influence on the binding force of coating and the degree of coating on the substrate.At the same time,the activation method affects the speed and thickness of electroless plating.In the surface pretreatment of polymer electroless plating,coarsening and activation methods have a great influence on the coating properties,especially for LCP and other polymers that will be used in 5G equipment.In polymer electroless plating pretreatment,coarsening processes such as chemical etching,plasma treatment and graft treatment,as well as activation processes such as ion adsorption reduction,catalyst direct adsorption and ink printing also have many new developments.In this paper,the latest development of coarsening and activation pretreatment of various polymer substrates in electronic applications is summarized,in order to provide reference for the development of electroless plating technology for electronic circuits.

关 键 词：化学镀 聚合物 表面改性 粗化 活化 

分 类 号：O631[理学—高分子化学]