紫外压印过程中的微结构模板脱模分析  

Template Release Mechanism of Ultraviolet Imprint Lithograph

作　　者：孙文婧[1] 李可[2] 李凤娇 黄尧[2] SUN Wenjing;LI Ke;LI Fengjiao;HUANG Yao(Shenyang Ligong University,Shenyang,Liaoning 110159,China;Beijing University of Chemical Technology,Beijing 100029,China;Beijing Research Institute of Mechanical and Electrical Technology Co.,Ltd.,Beijing 100083,China)

机构地区：[1]沈阳理工大学,辽宁沈阳110159 [2]北京化工大学,北京100029 [3]北京机电研究所有限公司,北京100083

出　　处：《塑料》2023年第2期151-155,186,共6页Plastics

摘　　要：紫外微压印制品的脱模过程可以直接影响制品的成型质量。为了解决微纳紫外压印过程中微结构脱模困难的问题,通过建立微纳紫外压印过程中的微结构模型,采用有限元模拟的方式得到微结构在脱模过程的受力云图,确定了紫外光固化胶与模板上应力集中的特征点,同时,得到了特征点采用不同脱模方法下的“应力-时间”曲线,分析特征点的应力状态,得到模板微结构深宽比及脱模方法对脱模过程的影响,通过对比可知,揭开式脱模与整体式脱模相比,紫外胶微结构更不易破损。最终,通过微纳紫外压印实验对模拟结果进行了验证,结果表明,揭开式脱模得到的抗反射微结构样品与整体式脱模得到的抗反射微结构样品的透光率相比,提高了3.1%,因此,揭开式脱模更完整地复制了抗反射微结构,证明了模拟结果的可靠性。The release process of UV printing was directly related to the molding quality of products.In order to solve the bottleneck problem of microstructure release in the process,by establishing the microstructure model in the process,the force cloud map of microstructure in the process was obtained by finite element simulation,and the characteristic point of stress concentration on UV curing glue and template was determined.The"stress-time"curve of the characteristic point under different release modes was obtained,so as to analyze the stress state of the characteristic points,and the depth ratio of the template microstructure and the release mode on the release process was obtained.It was concluded that open release was less likely to cause the damage of UV microstructure than vertical release.Finally,the simulation results were verified by micro-nano UV stamping experiment,and it was found that the transmittance of the anti-reflection microstructure sample obtained by release was 3.1% higher than that of the anti-reflection microstructure sample obtained by vertical release,which showed that the anti-reflection microstructure was copied more completely and proved the reliability of the simulation results.

关 键 词：微结构 紫外压印 脱膜 有限元模拟 透光率 

分 类 号：TP391.7[自动化与计算机技术—计算机应用技术] TQ320.66[自动化与计算机技术—计算机科学与技术]