激光重熔/电化学沉积交互处理铜涂层的微观组织及机理研究  

Microstructure and Mechanism of Copper Layer Processed with Laser Remelting and Electrochemical Deposition Interaction Process

作　　者：熊庭超 殷延益 陆丹华 吴国龙 王晔 姚建华[1,2,3] Xiong Tingchao;Yin Yanyi;Lu Danhua;Wu Guolong;Wang Ye;Yao Jianhua(School of Mechanical Engineering,Zhejiang University of Technology,Hangzhou 310023,Zhejiang,China;Laser Advanced Manufacturing Research Institute,Zhejiang University of Technology,Hangzhou 310023,Zhejiang,China;HighEnd Laser Manufacturing Equipment Province and Ministry Jointly Established Collaborative InnovationCenter,Hangzhou 310023,Zhejiang,China)

机构地区：[1]浙江工业大学机械工程学院,浙江杭州310023 [2]浙江工业大学激光先进制造研究院,浙江杭州310023 [3]高端激光制造装备省部共建协同创新中心,浙江杭州310023

出　　处：《中国激光》2023年第4期61-73,共13页Chinese Journal of Lasers

基　　金：国家自然科学基金(51975533,U2130122);浙江省基础公益研究计划项目(LGJ22E050002)。

摘　　要：为解决钛合金上直接电沉积铜沉积质量和结合力差的问题,本团队采用激光重熔/电化学沉积交互进行的方法在TC4合金上制备铜涂层,并采用光学显微镜、扫描电子显微镜、X射线衍射仪、自动划痕仪等分析了铜涂层的表面形貌、截面元素组成、截面厚度、物相、结合力、导电性和抗高温氧化性能。通过激光重熔获得了含有CuTi、Cu_(2)Ti、Cu_(4)Ti等金属间化合物的复合涂层,这使得沉积表面获得更多的活性位点,进而提高了沉积速率与沉积质量。实验结果显示:相比于传统的电沉积,激光重熔/电化学沉积交互处理可使重熔层表面的电极响应速率提高约44%,沉积层表面的孔隙明显减少,晶粒间结合更紧密;激光重熔/电化学沉积交互处理能显著提高钛合金表面铜沉积层的沉积质量、抗高温氧化性能以及涂层与基体间的结合力。Objective To improve the poor deposition quality and binding force of copper electrodeposited directly on titanium,a new laser remelting/electrochemical deposition interaction process is proposed to prepare a titanium-copper alloy layer and thicken the copper layer.The micromorphology,cross-sectional elements,coating thickness,and phase of the composite remelting layer obtained from laser remelting/electrochemical deposition interaction process are investigated.The effect mechanism of the laser electrochemical interaction on the electrical conductivity,high-temperature oxidation resistance,and adhesion to the substrate of the composite coating is discussed.Methods First,laser melting pretreatment is performed to replace the conventional chemical pretreatment,which simplifies the process,reduces environmental pollution,and reduces hazard to the human body.Thickening of the copper layer and its metallurgical binding to the matrix are achieved via laser remelting and electrochemical deposition.The first laser remelting is performed to obtain a titanium-copper seed layer,whereas the second laser remelting is performed to modify the surface of the deposited layer and reduce defects,such as porosity,crevices,and grain agglomeration.Consequently,the copper layer particles become refined and denser,which can facilitate the subsequent electrodeposition as well as thicken and improve the performance of the copper layer.The morphologies of the composite coating and composite remelting layer are characterized via scanning electron microscopy(Sigma HV-01-043,Carl Zeiss),and the elemental distribution on the cross-section of the composite remelting layer is analyzed using an X-ray energy-dispersive spectroscope connected to a scanning electron microscope.The cross-sectional morphology and thickness of the composite coating and composite remelting layer are observed using an optical microscope(Axio Imager A2M,ZEISS).The composite remelting layer obtained via interactive treatment is analyzed using an Xpert Pro X-ray diffractome

关 键 词：激光技术 激光重熔 电化学沉积 钛合金 结合力 沉积机制 

分 类 号：TG178[金属学及工艺—金属表面处理]