三防涂敷对电子元器件散热影响的研究  

Study on the Effect of Coating on the Heat Dissipation of Electronic Components

作　　者：吕谦 LYU Qian(AVIC Computing Technique Research Institute,Xi′an Shaanxi 710065,China)

机构地区：[1]航空工业西安航空计算技术研究所,陕西西安710065

出　　处：《机械研究与应用》2023年第2期61-63,共3页Mechanical Research & Application

摘　　要：为保证电子元器件在各种复杂服役环境中能够不受干扰正常工作,一般需要进行“防霉菌、防湿热、防盐雾”处理,即“三防”处理。但涂敷在元器件表面的三防涂层会增加热阻,降低元器件的散热效率。该文以典型风冷机箱和模块为研究对象,利用热仿真软件对常见的三种三防材料(丙烯酸1B31、有机硅1-2620、ParyleneC)涂敷器件进行仿真分析,并与不涂敷情况进行比较,总结归纳不同材料对元器件散热效果的影响,旨在为实际设计、生产提供一定指导作用。In order to ensure that the electronic components can be undisturbed in various complex service environment,three-proofing process(mildew,moisture and salt spray proofing)can usually be applied.However,the coating on surface may increase the thermal resistance and reduce heat dissipation efficiency.In this paper,based on the typical air-cooled chassis and modules,the component heat dissipation with and without three types of common conformal coating which includes 1B31,1-2620 and ParyleneC is analyzed and compared by using professional software;and influences of different materials on the heat dissipation effect of components are summarized.It aims to provide some guidance for practical design and production.

关 键 词：电子元器件 三防涂敷 散热 影响 热仿真 

分 类 号：TN602[电子电信—电路与系统]