多芯片组件(MCM)用金锡焊带材料电阻率及热导率温度特性研究  

Study on Temperature Characteristics of Resistivity and Thermal Conductivity of Gold Tin Solder Strip Used in MCM

作　　者：赵炜 李岩[1] 张磊[1] 彭博 王志强[3] ZHAO Wei;LI Yan;ZHANG Lei;PENG Bo;WANG Zhiqiang(China Academy of space technology,Beijing 100010;Project Management Center of Equipment Department and Space System Department of Strategic Support Force,Beijing 101318;Beijing Insititute of Tracking and Telecommunicaitons Technology,Beijing 100094)

机构地区：[1]中国空间技术研究院,北京100010 [2]战略支援部队航天系统部装备部项目管理中心,北京101318 [3]北京跟踪与通讯技术研究所,北京100094

出　　处：《宇航材料工艺》2023年第2期30-36,共7页Aerospace Materials & Technology

摘　　要：对牌号为Au80Sn20的金锡焊带材料在208~423 K的电阻率及热导率与温度的函数关系进行了研究,并对其在多芯片组件(MCM)中的传热效果进行了评估。分别对材料在208~423 K中5个温度点的电阻率及4个温度点的热导率进行了测试,基于理论模型建立电阻率/热导率随温度变化的函数关系,最终采用模拟热扩散数值方法评估材料在高温下的传热能力。结果表明,采用修正函数模型后,金锡焊带材料在208~423 K下热导率与电阻率的关系符合测试结果,随芯片表面温度的边界条件从208 K升高至423 K,采用变温热导率模型得到的热流密度模拟计算结果相比理想化恒定热导率模型的差异性逐渐升高至5.5%。综上,金锡焊带材料热导率与电阻率的关系符合Wiedemann-Franz法则修正后的Smith-Palmer方程,在该材料传热设计时应考虑其热导率温度效应。The functional relationship between resistivity and thermal conductivity and temperature of gold tin solder strip material with the brand of Au80Sn20 were studied in the temperature range of 208-423 K,and its heat transfer effect in MCM module was evaluated.The resistivity at five temperature points and thermal conductivity at four temperature points of the material in 208 K to 423 K were tested,respectively.Based on the theoretical model,the functional relationship between the resistivity and thermal conductivity with temperature was established.Finally,the heat transfer ability of the material at high temperature was evaluated by using the numerical method of simulated thermal diffusion.The results show that the relationship between the thermal conductivity and the resistivity of the solder strip material at 208 K to 423 K is consistent with the test results after using the modified function model.As the boundary condition of the chip surface temperature increases from 208~423 K,the difference between the simulation results of the heat flux density obtained by using the variable temperature thermal conductivity model and the idealized constant thermal conductivity model gradually increases to 5.5%,To sum up,the relationship between thermal conductivity and resistivity of gold solder strip material conforms to the Smith-Palmer equation modified by Wiedemann-Franz law,and the temperature effect of thermal conductivity should be considered in the heat transfer design of the material.

关 键 词：金锡焊带材料 模拟热扩散数值方法 Wiedemann-Franz法则 Smith-Palmer方程 

分 类 号：TG111.4[金属学及工艺—物理冶金]