基于国产金锡焊料的功率芯片焊接工艺及可靠性研究  

Study on the Welding Process and Application Reliability of Power Chips Based on Domestic Gold-tin Solder

作　　者：冯晓晶 夏维娟 赵晋敏 贾旭洲 赵炜 FENG Xiaojing;XIA Weijuan;ZHAO Jinmin;JIA Xuzhou;ZHAO Wei(Xi'an Institute of Space Radio Technology,Xi'an 710000;China Academy of Space Technology,Beijing 100010)

机构地区：[1]西安空间无线电技术研究所,西安710000 [2]中国空间技术研究院,北京100010

出　　处：《宇航材料工艺》2023年第2期74-78,共5页Aerospace Materials & Technology

摘　　要：金锡焊料具有强度高、抗氧化性好、抗疲劳、蠕变性能优良等优点,在混合集成电路中得到越来越多的应用,尤其是在大功率高可靠集成电路中通过共晶焊接来降低封装热阻和提高芯片焊接可靠性。本文分析了国产金锡焊料的基础特性,基于国产金锡焊料采用手动方式进行功率芯片摩擦共晶焊接关键控制参数焊接工艺研究;对功率芯片金锡焊接宇航应用可靠性进行验证。结果表明,经历系列严苛的宇航环境热力学试验,剪切强度满足相关标准要求并保持强度稳定,显示了焊接的高可靠性。Gold-tin solder had the advantages of high strength,good oxidation resistance,fatigue resistance,excellent screw performance and so on.It was more and more used in hybrid integrated circuits,especially in high power and high reliability integrated circuits to reduce package thermal resistance and improve the reliability of chip welding through eutectic welding.The foundational characteristics of the domestic gold-tin solder was analyzed,the key parameters of friction eutectic welding for power chip were studied by manual method based on domestic gold-tin solder.The reliability of gold-tin solder of power chip in space application was verified.The results show the shear strength meets the requirements of administrator and remains stable after a series of rigorous thermodynamics tests in aerospace environment,which shows the high reliability of welding.

关 键 词：国产焊料 功率器件 金锡焊接 可靠性 

分 类 号：TF124[冶金工程—粉末冶金]