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作 者:Jiang Guo Zengxu He Bo Pan Bin Wang Qian Bai Jinxing Kong Renke Kang
机构地区:[1]State Key Laboratory of High-Performance Precision Manufacturing,Department of Mechanical Engineering,Dalian University of Technology,Dalian,116024,China [2]Institute of Mechanical Manufacturing Technology,China Academy of Engineering Physics,Mianyang,621999,China
出 处:《Chinese Journal of Mechanical Engineering》2023年第1期80-89,共10页中国机械工程学报(英文版)
基 金:National Key Research and Development Program of China(Grant No.2018YFA0702900);Science Challenge Project of China(Grant No.TZ2016006);National Natural Science Foundation of China(Grant No.51975096)。
摘 要:Double-sided lapping is an precision machining method capable of obtaining high-precision surface.However,during the lapping process of thin pure copper substrate,the workpiece will be warped due to the influence of residual stress,including the machining stress and initial residual stress,which will deteriorate the flatness of the workpiece and ultimately affect the performance of components.In this study,finite element method(FEM)was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping.Considering the initial residual stress of the workpiece,the stress caused by the lapping and their distribution characteristics,a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters.The results showed that the primary cause of the warping deformation of the workpiece in the doublesided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces.The finite element simulation results were in good agreement with the experimental results.
关 键 词:Machining deformation Double-sided lapping Residual stress Finite element simulation
分 类 号:TG580.68[金属学及工艺—金属切削加工及机床]
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