GT30光板的缺陷检测方法  

Defect Detection Method of GT30 Light Board

作　　者：陈昌宗 詹伟剑 徐慧 赵转哲[2] CHEN Changzong;ZHAN Weijan;XU Hui;ZHAO Zhuanzhe(CEPREI,Guangzhou 511370,China;School of Mechanical Engineering,Anhui Polytechnic University,Wuhu 241000,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]安徽工程大学机械工程学院,安徽芜湖241000

出　　处：《电子产品可靠性与环境试验》2023年第2期6-9,共4页Electronic Product Reliability and Environmental Testing

摘　　要：目前PCB被广泛地应用于各种电子零部件中。PCB在生产过程中可能会因为各种因素而导致出现缺陷,最终影响产品的质量。因此,及时、有效地检测出PCB的质量缺陷就成了一个急需解决的问题。为此,以GT30光板为检测对象,参考IPC-TM-6502.1.1F:2015和GB/T 16594-2018标准要求,对样品进行了固封、研磨、抛光和蚀刻等处理,使用金相显微镜进行切片检查、不同位置的铜厚(PCB侧焊盘)测量和IMC检测。通过对检测结果的数据和图像进行分析,可以得出该方法能够精准有效地检测出GT30光板中的缺陷,且对厚度的检测精度能达到0.01μm,具有一定的参考价值。At present,PCB is widely used in various electronic components.PCB defects may occur in the production process due to various factors,which will ultimately affect the quality of the product.Therefore,timely and effective detection of PCB quality defects has become an urgent problem to be solved.To this end,taking the GT30 light plat as the detection object,the sample is solidified,ground,polished,etched according to IPC-TM-6502.1.1F2015 and GB/T 16594-2018,and the metallographic microscope is used for biopsy examination,copper thickness(PCB side pad)measurement and IMC inspection in different positions.Through the analysis of the data and images of the inspection results,it can be concluded that the method can accurately and effectively detect the defects in the GT30 light plate,and the detection accuracy of the thickness can reach 0.01μm.So,it has certain reference value.

关 键 词：印刷电路板 光板 切片检测 金属间氏合物检测 铜厚测量 检测精度 

分 类 号：TN41[电子电信—微电子学与固体电子学] TH742.4[机械工程—光学工程]