FCBGA封装集成电路在实际应用中的失效研究  

Failure Research of FCBGA Packaged Integrated Circuits in Practical Applications

作　　者：王敏 黄志强 方建明 陈选龙 WANG Min;HUANG Zhiqiang;FANG Jianming;CHEN Xuanlong(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2023年第2期15-20,共6页Electronic Product Reliability and Environmental Testing

摘　　要：FCBGA封装集成电路在实际应用中会出现多种多样的失效模式和失效机理。介绍了在FCBGA封装集成电路失效分析中常用的检测设备与技术,包括X射线检测系统、声学扫描显微镜、OBIRCH背面定位技术和扫描电子显微镜等,并结合实际应用中的失效案例,对芯片开裂、凸点重熔、凸点开裂和过电应力4种失效机理展开了分析,为后续FCBGA封装集成电路的失效分析提供了参考方向。There are various failure modes and failure mechanisms in FCBGA packaged integrated circuits in practical applications.The commonly used equipments and technologies in the failure analysis of FCBGA packaged integrated circuits are introduced,including X-ray detection system,acoustic scanning microscope,OBIRCH backside positioning technology and scanning electron microscope.Combined with the failure cases in real-world application,four failure mechanisms of chip cracking,bump remelting,bump cracking and electrical overstress are analyzed,which provides a reference direction for the subsequent failure analysis of FCBGA packaged integrated circuits.

关 键 词：倒装芯片球栅格阵列 集成电路 失效分析 声学扫描显微镜 基于光束感生电阻变化 X射线 

分 类 号：TN43[电子电信—微电子学与固体电子学]