片式多层陶瓷电容器的击穿特性研究  

Research on Breakdown Characteristics of Chip Multilayer Ceramic Capacitors

作　　者：刘勇 莫富尧 石高明[1] 冯丽婷 李伟利 LIU Yong;MO Fuyao;SHI Gaoming;FENG Liting;LI Weili(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2023年第2期66-70,共5页Electronic Product Reliability and Environmental Testing

摘　　要：对引起片式多层陶瓷电容器(MLCC)击穿失效的主要因素进行了研究。根据MLCC的实际结构特点和材料特性建立模型,利用有限元模拟方法分析了典型缺陷对MLCC样品内部电场强度分布的影响,进一步地总结、分析了MLCC样品的击穿特性,具有一定的参考价值。The main factors causing breakdown failure of chip multilayer ceramic capacitors(MLCC)are studied.The models are established according to the actual structural characteristics and materials properties of MLCC,and the impact of typical defects on the distribution of electric field inside the MLCC is analyzed by the finite element simulation,and the breakdown characteristics of MLCC are further summarized and analyzed,it has certain reference value.

关 键 词：多层陶瓷电容器 缺陷 失效 击穿特性 

分 类 号：TP391.99[自动化与计算机技术—计算机应用技术]