Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film  

作　　者：Huayang DANG Dongpei QI Minghao ZHAO Cuiying FAN C.S.LU 

机构地区：[1]School of Mechanics and Safety Engineering,Zhengzhou University,Zhengzhou 450001,China [2]School of Mechanical Engineering,Zhengzhou University,Zhengzhou 450001,China [3]School of Civil and Mechanical Engineering,Curtin University,Western Australia 6845,Australia

出　　处：《Applied Mathematics and Mechanics(English Edition)》2023年第5期841-856,共16页应用数学和力学（英文版）

基　　金：Project supported by the National Natural Science Foundation of China(Nos.11572289,1171407,11702252,and 11902293);the China Postdoctoral Science Foundation(No.2019M652563)。

摘　　要：In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact interface is assumed to be nonslipping,with both perfectly bonded and debonded boundary conditions.The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress,which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials.The expressions are explicitly obtained for the phonon interfacial shear stress,internal normal stress,and stress intensity factors(SIFs).Finally,based on numerical calculations,we briefly discuss the effects of the material mismatch,the geometry of the QC film,and the debonded length and location on stresses and SIFs.

关 键 词：one-dimensional(1D)hexagonal quasicrystal(QC)film stress intensity factor(SIF) thermal variation Chebyshev polynomial interfacial behavior 

分 类 号：O343.1[理学—固体力学]