某大功率固态合成功放组件散热设计  

A thermal design of high power solid-state combining power amplifier

作　　者：袁振 成海峰[1] 喻先卫 Yuan Zhen;Cheng Haifeng;Yu Xianwei(Nanjing Electronic Devices Institute,Jiangsu Nanjing,210016,China)

机构地区：[1]南京电子器件研究所,江苏南京210016

出　　处：《机械设计与制造工程》2023年第4期121-124,共4页Machine Design and Manufacturing Engineering

摘　　要：某大功率固态合成功放组件采用了空间功率合成技术,且热流密度较大,对组件的热设计提出了更为严格的要求。首先对散热进行理论分析,在固态合成功放组件散热设计中加入L型均温板实现三维空间内热量的快速传递;然后运用Icepak软件对功放组件进行仿真计算,提出了一种满足使用要求的散热结构;最后通过产品实测验证了该热设计方案的可行性,为后续类似功放产品热设计提供了新的思路。A high power solid state combined the power amplifier is designed by spatial combining with high heat flux density;It puts forward more stringent requirements for thermal design of the assembly.It analyzes the heat dissipation theoretically.In the heat dissipation design of solid assembly,the L-shaped uniform-temperature plate is added to strengthen the heat transfer in 3D space.Then Icepak is used to simulate the components and a heat dissipation structure is proposed to meet the thermal requirements,the physical test after installation verifies the feasibility of the thermal design scheme of the components.This design provides a new idea for thermal design of similar power amplifier products.

关 键 词：固态功放 空间功率合成 L型均温板 

分 类 号：TK124[动力工程及工程热物理—工程热物理]