半导体激光器低热阻液冷热沉研究现状与展望  

Research Status and Prospect of Low Thermal Resistance Liquid-cooled Heatsink Applied in Laser Diode

作　　者：陈琅 刘嘉辰 张佳晨 王贞福[1] 王丹 李特[1] CHEN Lang;LIU Jiachen;ZHANG Jiachen;WANG Zhenfu;WANG Dan;LI Te(State Key Laboratory of Transient Optics and Photonics,Xi’an Institute of Optics and Precision Mechanics,Chinese Academy of Sciences,Xi’an 710119,China;University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院西安光学精密机械研究所瞬态光学与光子国家重点实验室,西安710119 [2]中国科学院大学,北京100049

出　　处：《材料导报》2023年第10期84-91,共8页Materials Reports

基　　金：国家自然科学基金(61504167);陕西省自然科学基金(2022JQ-531,2019ZY-CXPT-03-05,2018JM6010,2015JQ6263);陕西省科技厅人才项目(2017KJXX-72)。

摘　　要：近年来,半导体激光器输出功率持续增加,引发热负载受限问题。热负载使芯片有源区产生温升,进一步影响芯片温度分布,导致半导体激光器(Laser diode,LD)芯片性能逐渐劣化。而对于确定的封装形式,热沉热阻成为控制温升的决定性因素。因此,降低热沉热阻对提升半导体激光器输出能力与光束性质具有重要意义。液冷热沉可以有效降低热阻,本文从液冷热沉材料、液冷热沉结构和液冷冷媒性质三个方面,回顾了近30年LD液冷热沉热阻演变进程,总结了液冷热沉发展过程中热阻的影响因素,进一步探讨了降低热阻的发展方向与应用前景。In recent decades,the output power of laser diode has been continuously increasing,leading to the restricted problem of thermal loads.The thermal load causes a temperature increment in the active region of the LD chip,which further impacts the chip temperature distribution and leads to a gradual deterioration of the LD bar performance.For a defined package configuration,the thermal resistance of the heatsink becomes a decisive factor in controlling the temperature rise.Therefore,it is important to reduce the thermal resistance of the heatsink in order to improve the output power capability and beam properties of semiconductor lasers.From three aspects:liquid-cooled heatsink materials,liquid-cooled heatsink structures and liquid-cooled refrigerant properties,this paper reviews the evolution of thermal resistance of liquid-cooled heatsinks in the last three decades.We also summarize the factors influencing thermal resistance during the development of liquid-cooled heatsinks,and further discuss the development direction and application prospects of heatsink thermal resistance reduced.

关 键 词：半导体激光器 液冷热沉 热阻 结构 材料 冷媒 

分 类 号：TN248.4[电子电信—物理电子学]