工艺参数对键合金丝质量影响的研究  

Study on Effects of Bonding Parameter on Quality of Gold Wire

作　　者：王子伊 付明浩 张晓宇 王晶 王代兴 孙浩洋 何钦江 Wang Ziyi;Fu Minghao;Zhang Xiaoyu;Wang Jing;Wang Daixing;Sun Haoyang;He Qinjiang(Beijing Institute of Remote Sensing Equipment,Beijing 100854)

机构地区：[1]北京遥感设备研究所,北京100854

出　　处：《航天制造技术》2023年第1期51-55,共5页Aerospace Manufacturing Technology

基　　金：国家自然科学基金“叶企孙”科学基金项目(U2141218)。

摘　　要：金丝键合技术是微电子领域的封装技术,一般采用金线,利用热、压、超声共同作用,完成微电子器件中电路内部连接,即芯片和电路或者引线框架之间的互连。本文在深入了解键合机理后,选用25μm金丝,基于正交试验方法,研究键合压力、超声功率、键合时间等参数对楔焊键合及球焊键合后金丝拉力及焊点形貌的影响,根据键合强度拉力值确定键合的最佳工艺参数范围。Gold wire bonding is a packaging technology in the field of microelectronics,which generally adopts gold wire and uses heat,pressure and ultrasound to complete the internal connection of the circuit in the microelectronics device.In this paper,the orthogonal experiment design method is applied to experimental study on the effects of bonding pressure,ultrasonic power,bonding time on the tension and solder spot morphology of ball welding bonding and wedge welding bonding of 25μm gold wire.The optimal range of bonding process parameters is determined according to the value of bonding strength tension.

关 键 词：楔焊键合 球焊键合 正交试验 工艺参数优化 

分 类 号：V19[航空宇航科学与技术—人机与环境工程]