Co‑packaged optics(CPO):status,challenges,and solutions  

作　　者：Min Tan Jiang Xu Siyang Liu Junbo Feng Hua Zhang Chaonan Yao Shixi Chen Hangyu Guo Gengshi Han Zhanhao Wen Bao Chen Yu He Xuqiang Zheng Da Ming Yaowen Tu Qiang Fu Nan Qi Dan Li Li Geng Song Wen Fenghe Yang Huimin He Fengman Liu Haiyun Xue Yuhang Wang Ciyuan Qiu Guangcan Mi Yanbo Li Tianhai Chang Mingche Lai Luo Zhang Qinfen Hao Mengyuan Qin 

机构地区：[1]School of Optical and Electronic Information,Huazhong University of Science and Technology,Wuhan 430074,China [2]Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,China [3]Department of Electronic and Computer Engineering,The Hong Kong University of Science and Technology,Hong Kong,China [4]HKUST Fok Ying Tung Research Institute,Guangzhou 511462,China [5]The Hong Kong University of Science and Technology(Guangzhou),Guangzhou 511462,China [6]Chongqing United Micro-Electronics Center(CUMEC),Chongqing 401332,China [7]Hisense Broadband Multimedia Technologies Co.,Ltd.,Qingdao 266000,China [8]Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China [9]State Key Laboratory of Superlattices and Microstructures,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China [10]School of Microelectronics,Xi’an Jiaotong University,Xi’an 710049,China [11]Zhangjiang Laboratory,Shanghai 201210,China [12]The State Key Laboratory of Advanced Optical Communication Systems and Networks,Department of Electronic Engineering,Shanghai Jiao Tong University,Shanghai 200240,China [13]Huawei Technologies Co.,Ltd.,Shenzhen 440307,China [14]College of Computer,National University of Defense Technology,Changsha 410073,China [15]Institute of Computing Technology,Chinese Academy of Sciences,Beijing 100086,China

出　　处：《Frontiers of Optoelectronics》2023年第1期1-40,共40页光电子前沿（英文版）

基　　金：supported by the National Key Research and Development Program of China(No.2019YFB2203004).

摘　　要：Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.

关 键 词：Co-packaged optics Silicon photonics High-performance computing Advanced packaging External laser Optical power delivery CO-SIMULATION STANDARDIZATION Transmitter Receiver 

分 类 号：TN15[电子电信—物理电子学]