新型酚醛—亚胺—环氧胶粘剂的制备与性能研究  

Study on preparation and properties of novel phenolic-imine-epoxy adhesive

作　　者：王兆昊 虞鑫海 李枝芳 Wang Zhaohao;Yu Xinhai;Li Zhifang(Department of Applied Chemistry,College of Chemistry and Chemical Engineering,Donghua University,Shanghai 201620,China;Shandong Shengquan New Materials Co.,Ltd.,Ji’nan 250204,Shandong,China)

机构地区：[1]东华大学化学与化工学院应用化学系,上海201620 [2]山东圣泉新材料股份有限公司,山东济南250204

出　　处：《中国胶粘剂》2023年第4期22-27,共6页China Adhesives

摘　　要：以酚醛-酰亚胺树脂(HPMI-F树脂)和酚醛-酰胺酸树脂(HPMA-F树脂)为改性剂,端羧基丁腈橡胶为增韧剂,邻甲酚醛环氧和环氧E-51为基体树脂,再加入固化剂、促进剂和稀释剂,制备了两组新型酚醛-酰亚胺改性环氧胶粘剂(MIF-E)和酚醛-酰胺酸改性环氧胶粘剂(MAF-E)。探究了其黏度、凝胶时间、力学性能、介电性能和吸水率等。研究结果表明:MIF-E的黏度更低,拉伸剪切强度更优,施胶工艺性更好,吸水率低(最低可达1.52%),疏水性良好;MIF-E的表观活化能比MAF-E的表观活化能更高,固化反应速率更小,并且室温储存性良好;两种树脂改性环氧胶粘剂的介电性能优良,MAF-E的相对介电常数更低,1 MHz时为2.11;两种树脂改性环氧胶粘剂的介质损耗因子相近,1 MHz时均小于1.7%。制备的酚醛-亚胺-环氧胶粘剂的介电性能优良、室温储存性良好、工艺性较好、疏水性较好,对配方进一步优化后,在半导体封装材料领域有着良好的应用前景。Two groups of novel phenolic-imide modified epoxy adhesive(MIF-E)and phenolic-amidate modified epoxy adhesive(MAF-E)were prepared with phenolic-imide resin(HPMI-F resin)and phenolicamidate resin(HPMA-F resin)as modifiers,carboxyl terminated nitrile rubber as toughening agent,and o-cresol formaldehyde epoxy and epoxy E-51 as matrix resins,followed by the addition of curing agent,accelerator and diluent agent.Their viscosity,gel time,mechanical properties,dielectric properties and water absorption were investigated.The research results showed that MIF-E had lower viscosity,better tensile shear strength,better sizing process,low water absorption rate(lowest to 1.52%),and good hydrophobicity.The apparent activation energy of MIF-E was higher than that of MAF-E,with lower curing reaction rate and good room temperature storage performance.The dielectric properties of two resin modified epoxy adhesive were excellent,and the relative dielectric constant of MAF-E was lower,which was 2.11 at 1 MHz.The dielectric loss factors of two resin modified adhesive were similar,which were less than 1.7%at 1 MHz.The prepared phenolic-imine-epoxy adhesive had excellent dielectric properties,good room temperature storage performance,good processability,and good hydrophobicity,which had good application prospects in the field of semiconductor packaging materials after further optimization of the formula.

关 键 词：酚醛-酰亚胺树脂 酚醛-酰胺酸树脂 酚醛-酰亚胺-环氧胶粘剂 酚醛-酰胺酸-环氧胶粘剂 

分 类 号：TQ430[化学工程]