高折率有机硼硅粘接促进剂的合成及其在封装胶中的应用  

Synthesis of organic borosilicone adhesion promoter with high refractive index and its application in packaging adhesive

作　　者：潘科学 梁广强 梁广伟 钟炜洪 周敏活 吴明华 梁广耀 Pan Kexue;Liang Guangqiang;Liang Guangwei;Zhong Weihong;Zhou Minhuo;Wu Minghua;Liang Guangyao(Guangdong Sheensun Technology Co.,Ltd.,Foshan 528145,Guangdong,China)

机构地区：[1]广东新翔星科技股份有限公司,广东佛山528145

出　　处：《中国胶粘剂》2023年第4期35-39,45,共6页China Adhesives

摘　　要：以苯基三乙氧基硅烷(PTES)、二苯基二甲氧基硅烷(DPDMS)、乙烯基二甲基乙氧基硅烷(VDMES)、3-甲基丙烯酰氧基丙基三甲氧基硅烷(MPTMS)、3-环氧丙氧基丙基三甲氧基硅烷(GPTMS)和硼酸(BA)等为原料,通过分步水解缩聚法合成了高折率有机硼硅粘接促进剂(HBSA)。采用傅里叶变换红外光谱法(FT-IR)、核磁共振氢谱法(1H-NMR)、核磁共振硅谱法(29Si-NMR)和核磁共振硼谱法(11B-NMR)对HBSA的结构进行了表征。同时使用HBSA制备了自黏性高折率加成型有机硅封装胶,并对其性能进行了研究。研究结果表明:当HBSA的质量份数为1.5份时,封装胶的粘接剪切强度为2.24 MPa,比未加粘接促进剂时提高了3.2倍,拉伸强度为5.79 MPa,断裂伸长率为63%,邵D硬度为56,折射率为1.536,在450 nm处的透光率为91%,黏度为6350 mPa·s,综合性能较佳,可以满足LED封装要求。The organic borosilicone adhesion promoter with high refractive index(HBSA)was synthesized by step hydrolysis-condensation reaction of phenyltriethoxysilane(PTES),diphenyldimethoxysilane(DPDMS),vinyl dimethylethoxylsilane(VDMES),3-methylacryloxypropyl trimethoxysilane(MPTMS),3-epoxypropyl trimethoxylsilane(GPTMS)and boric acid(BA)as raw materials.The structure of HBSA was characterized by Fourier transform infrared spectroscopy(FT-IR),nuclear magnetic resonance hydrogen spectroscopy(1H-NMR),nuclear magnetic resonance silicon spectroscopy(29Si-NMR)and nuclear magnetic resonance boron spectroscopy(11B-NMR).At the same time,HBSA was used to prepare self-adhesive addition-type organic silicon packaging adhesive with high refractive index,and its properties were studied.The research results showed that when the mass fraction of HBSA was 1.5 phr,the bonding shear strength of packaging adhesive was 2.24 MPa,which was 3.2 times higher than that without the adhesion promoter.The tensile strength was 5.79 MPa,the elongation at break was 63%,the Shore D hardness was 56,the refractive index was 1.536,the transmittance at 450 nm was 91%,and the viscosity was 6350 mPa·s.The comprehensive performance was quite good,which could meet the requirements of LED packaging.

关 键 词：高折率 有机硼硅粘接促进剂 有机硅封装胶 应用 

分 类 号：TQ430[化学工程]