全金属间化合物微焊点的制备及性能表征研究进展  

Research progress on preparation and characterization of full IMC micro-joints

作　　者：施权 张志杰[1] 高幸 魏红 周旭 耿遥祥[1] SHI Quan;ZHANG Zhi-jie;GAO Xing;WEI Hong;ZHOU Xu;GENG Yao-xiang(School of Materials Science and Engineering,Jiangsu University of Science and Technology,Zhenjiang 212003,China)

机构地区：[1]江苏科技大学材料科学与工程学院,镇江212003

出　　处：《中国有色金属学报》2023年第4期1129-1143,共15页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(51801079);江苏省自然科学基金资助项目(BK20180987)。

摘　　要：基于微凸点和硅通孔的3D封装是一种通过多层芯片垂直互连堆叠,将芯片技术与封装技术进行结合的新技术,满足了电子产品微型化、高性能的发展需求,是实现下一代超大规模集成微系统的核心互连技术。3D封装技术对互连焊点有一个特殊的要求,即在向上堆叠芯片时,低级封装的焊点不应被重新熔化。低温下制备全金属间化合物(Intermetallic compound, IMC)微焊点为实现叠层芯片互连提供了新的解决方案。本文对近年来全IMC微焊点的制备工艺和基本原理进行综合分析;揭示Cu-Sn系统界面反应的扩散机制及IMC生长动力学规律;对比不同键合参数下全IMC微焊点的服役可靠性。最后,指出各种全IMC微焊点制备工艺的优缺点,并对其未来研究发展趋势进行展望。3D packaging based on micro-bumps and through silicon via is a new technology that combines chip technology and packaging technology through vertical interconnection of multi-layer chips.It meets the development demand for small size and high performance of electronic products.It is the core of interconnection technology to realize the next generation of very large scale integrated micro-system.3D packaging technology has a special requirement for interconnect micro-joints that the micro-joints in the low-level package should not be remelted when stacking chips upward.The preparation of full intermetallic compound(IMC)micro-joints at low temperature provides a new solution for realizing the interconnection of multi-layer chips.In this paper,the preparation methods of full IMC micro-joints and basic principle of each method in recent years were analyzed comprehensively.The diffusion mechanism of interfacial reaction of Cu-Sn system and the growth kinetics of IMC were revealed.The service reliability of full IMC micro-joints was compared under different bonding parameters.Finally,the advantages and disadvantages of various preparation methods of full IMC micro-joints were pointed out,and the future research and development trends were forecasted.

关 键 词：全金属间化合物微焊点 瞬态液相键合 温度梯度键合 电流驱动键合 超声辅助瞬时液相键合 瞬态液相烧结 

分 类 号：TG425.1[金属学及工艺—焊接]