基于SIP模块的瓦片式有源阵列天线的一体化设计  

Design of Tile Integrated Active Array Antenna Based on SIP Module

作　　者：徐梦苑 刘麒 汤君坦 韦逸 魏紫东 XU Mengyuan;LIU Qi;TANG Juntan;WEI Yi;WEI Zidong(Nanjing Electronic Devices Institute,Nanjing,210016,CHN;Shanghai Aerospace Electronic Communication Equipment Institute,Shanghai,201108,CHN)

机构地区：[1]南京电子器件研究所,南京210016 [2]上海航天电子通讯设备研究所,上海201108

出　　处：《固体电子学研究与进展》2023年第2期168-174,共7页Research & Progress of SSE

摘　　要：基于三维系统级封装(3D-SIP)技术设计实现了一款工作于X波段的瓦片式一体化有源阵列天线。该有源阵列天线基于多通道SIP模组技术与高密度垂直互连技术将有源通道与平面天线进行一体化集成。设计的瓦片式一体化有源阵列天线包含6×8个T/R通道,可以在8.6~10.0 GHz频段内实现大于±45°的扫描能力,最大等效全向功率(EIRP)值为65.2 dBm,阵面尺寸128 mm×96 mm×13 mm,重量303 g。仿真与实测结果表明,提出的基于3D-SIP技术的瓦片式一体化有源阵列天线具备低剖面、小型化、低成本、高性能及高可靠性等产品优势,可以在雷达、通信及成像等系统中广泛推广应用。A tile integrated active array antenna operating in X-band was designed and implemented based on 3D-SIP technology in this paper.The active array antenna integrated active channels and planar antennas based on multi-channel SIP module technology and high-density vertical interconnection technology.The tile integrated active array antenna designed in this paper consists of 6X8 T/R channels,which can achieve scanning capability better than ±30°in 8.6-10 GHz frequency band,the maximum equivalent isotropically radiated power(EIRP)value is 65.2 dBm,the array size is 128 mm×96 mm×13 mm and the weight is 303 g.The simulation and measurement results show that the tile integrated active array antenna based on 3D-SIP technology proposed in this paper has the advantages of low profile,miniaturization,low cost,high performance and high reliability,and can be widely used in rader,communication and imaging systems.

关 键 词：瓦片式 一体化 SIP模块 低剖面 小型化 

分 类 号：TN61[电子电信—电路与系统]