聚醚醚酮化学镀Ni-P及Ni-Cu-P镀层微观结构及性能对比研究  

Comparative Study on Microstructure and Properties of Electroless Ni-P and Ni-Cu-P Coatings Deposited on PEEK

作　　者：周柏玉[1] ZHOU Bai-yu(Modern Equipment Manufacturing Institute,Chenzhou Vocational Technical College,Chenzhou 423000,China)

机构地区：[1]郴州职业技术学院现代装备制造学院,湖南郴州423000

出　　处：《材料保护》2023年第5期127-132,147,共7页Materials Protection

基　　金：2022年湖南省教育厅科学研究项目(22B0946)资助。

摘　　要：为更好地了解Ni-P和Ni-Cu-P镀层的优缺点,在聚醚醚酮表面通过化学镀沉积了Ni-P和Ni-Cu-P 2种镀层。对比了不同工艺下化学镀Ni-P和Ni-Cu-P的沉积速率,利用扫描电镜、能谱仪、X射线衍射仪分析了镀层的表面形貌、成分和结构,应用显微硬度计和表面粗糙度测试仪、MM-200磨损实验机对镀层硬度、表面粗糙度和耐磨性进行了测试,通过电化学性能和电磁屏蔽性能测试对比研究了镀层的电化学性能和电磁屏蔽性能。研究表明:化学镀Ni-Cu-P具有更快的沉积速率,Ni-Cu-P镀层为致密的混晶态菜花状组织,镀层硬度更高,磨损后期耐磨性更好,且具有更优的电磁屏蔽性能;Ni-P镀层为致密的非晶态节瘤状组织,表面更光滑,磨损初期耐磨性更好,具有更好的电化学性能。In order to better understand the advantages and disadvantages of Ni-P and Ni-Cu-P coatings,Ni-P and Ni-Cu-P coatings were deposited on surface of polyether ether ketone(PEEK)by electroless plating.Deposition rates of electroless Ni-P coating and Ni-Cu-P coating under different processes were compared.Surface morphology,composition and structure of the coatings were investigated through scanning electron microscope(SEM),energy-dispersive spectrometer(EDS)and X-ray diffractometer(XRD).Microhardness tester,surface roughness tester and MM-200 wear testing machine were used to evaluate the hardness,surface roughness and wear resistance of the coatings.The electrochemical performance and electromagnetic shielding performance of coatings were compared and studied through electrochemical performance and electromagnetic shielding performance tests.Results showed that electroless Ni-Cu-P coating had higher deposition rate.Ni-Cu-P coating was of a dense mixed crystal cauliflower-like structure,with higher hardness,better wear resistance in the later stage of wear,and better electromagnetic shielding performance.Whereas,the Ni-P coating was of a dense amorphous nodular structure with a smoother surface,better wear resistance in the early stage of wear,and better electrochemical performance.

关 键 词：化学镀 耐磨性 电化学性能 电磁屏蔽性能 

分 类 号：TG174.4[金属学及工艺—金属表面处理]