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作 者:刘德强 周圣丰 LIU De-qiang;ZHOU Sheng-feng(Shenzhen Shengyuan Semiconductor Co.,Ltd.,Shenzhen 518100,China;Research Institute of Advanced Wear and Corrosion Resistance and Functional Materials,Jinan University,Guangzhou 510632,China)
机构地区:[1]深圳市盛元半导体有限公司,深圳518100 [2]暨南大学先进耐磨蚀及功能材料研究院,广东广州510632
出 处:《材料保护》2023年第5期148-152,共5页Materials Protection
摘 要:针对铜基引线框架镀锡层高温易缩锡变色及常温不耐盐水腐蚀等问题,采用了不同电镀工艺,分析了镀层显微形貌、物相结构、抗电化学腐蚀性能与力学性能。结果表明:镀锡前,对铜表面进行充分去氧化及粗化,可极大提高镀锡层结合力,有效防止高温缩锡现象;镀锡后,镀层浸泡抗高温氧化剂,可有效防止高温发黄以及提高耐盐水腐蚀性能。Aiming at the problems such as high temperature shrinkage and discoloration of tin plating on copper-based lead frames,as well as poor resistance to salt water corrosion at room temperature,different electroplating processes were used to analyse the microstructure,phase structure,electrochemical corrosion resistance,and mechanical properties of the coating.Results showed that the sufficient deoxidation and coarsening of copper surface before tin-plating could significantly improve the bonding strength of tin-plating and effectively prevent the tin-shrinkage phenomenon at high temperature.After tin plating,soaking the coating in anti-high-temperature oxidant solution could effectively prevent yellowing at high temperature and improve the corrosion resistance in salt-water.
分 类 号:TQ153.13[化学工程—电化学工业]
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