准静态加载下HMX基PBX断裂行为的温度效应  

Temperature Effects on the Fracture Behavior of HMX⁃Based PBX Under Quasi⁃Static Loading

作　　者：董天宝[1] 袁洪魏 文乾乾 庞海燕[1] 赵龙 李云欣 DONG Tian-bao;YUAN Hong-wei;WEN Qian-qian;PANG Hai-yan;ZHAO Long;LI Yun-xin(Institute of Chemical Materials,CAEP,Mianyang 621999,China)

机构地区：[1]中国工程物理研究院化工材料研究所,四川绵阳621999

出　　处：《含能材料》2023年第5期440-447,共8页Chinese Journal of Energetic Materials

基　　金：国家自然科学基金资助(12002322,12002323)。

摘　　要：为了研究温度对准静态加载下奥克托今(HMX)基高聚物黏结炸药(PBX)断裂行为的影响规律,利用半圆盘弯曲(Semi-circular Bending,SCB)准静态断裂试验,采用数字图像相关法(Digital Image Correlation Method,DICM)和基于裂纹扩展计(Crack Propagation Gauge,CPG)的裂纹扩展速率测试系统,研究了25,35,45,55,60℃和65℃下HMX基PBX的断裂特征、断裂阻力、损伤容限和裂纹失稳扩展速率。结果表明,随着温度升高,HMX基PBX断裂特征从脆性断裂逐渐转变为韧性断裂,表征裂纹起裂阻力的断裂韧度显著降低,损伤容限有一定的增强。半圆盘准静态弯曲脆性断裂条件下,裂纹失稳扩展速率在扩展路径上呈现出慢-快-慢的规律,最高速率约370 m·s^(-1),温度升高导致裂纹失稳扩展速率有一定程度的降低。To investigate the temperature effects on fracture behavior of HMX-based polymer bonded explosives(PBX)under quasi-static loading,the digital image correlation method(DICM)and crack propagation gauge(CPG)testing system were used in quasi-static fracture tests of the semi-circular bending(SCB).The fracture characteristics,fracture resistance,damage toler-ance and crack unstable propagation rate of HMX-based PBX at different temperatures(25,35,45,55,60,65℃)were stud-ied.The results show that with the increase of temperature,the fracture characteristics of HMX-based PBX gradually transform from brittle fracture to ductile fracture,the fracture toughness which indicates the crack initiation resistance significantly decreas-es,and the damage tolerance is slightly improved.Under the brittle fracture condition of SCB,the crack unstable propagation rate shows a slow-fast-slow law on the propagation path,with a maximum rate of about 370 m·s^(-1).The increase in temperature leads to some reduction in the crack unstable propagation rate.

关 键 词：高聚物黏结炸药(PBX) 断裂行为 温度效应 损伤容限 数字图像相关法 

分 类 号：TJ55[兵器科学与技术—军事化学与烟火技术] O346.1[理学—固体力学]