新型三维集成射频模拟数字一体化微系统  

New Three-Dimensional Integrated RF-Analog-Digital Microsystem

作　　者：张君直 杨进[2] 张强 曹雪松 朱健[2] ZHANG Junzhi;YANG Jin;ZHANG Qiang;CAO Xuesong;and ZHU Jian(School of Information Science and Engineering,Southeast University,Nanjing 210096;Nanjing Electronic Devices Institute,Nanjing 210016)

机构地区：[1]东南大学信息科学与工程学院,南京210096 [2]南京电子器件研究所,南京210016

出　　处：《电子科技大学学报》2023年第3期372-378,共7页Journal of University of Electronic Science and Technology of China

摘　　要：设计了一种新型三维集成射频模拟数字一体化微系统。传统的射频前端尺寸为250 mm×120 mm,经过微系统集成后尺寸仅为37 mm×37 mm,面积减小了95%。该微系统基于一体化陶瓷三维封装架构,集成多种裸芯片和无源器件,实现内部信号的电气互连;采用一种全新的散热方案,定制开发了一种高导热复合热沉盖板,热导率从15 W/(m·K)提升至150 W/(m·K)以上。在FC裸芯片和盖板之间填充导热硅胶,形成了一条新的散热途径,达到高效散热的效果。Recent years,microsystem has become one of the hot issues in electronic information field.This paper introduces a new three-dimensional integrated radio frequency(RF)-analog-digital microsystem.The architecture,process and verification of the microsystem are described in detail from the aspects of scheme and implementation.The traditional RF frontend is 250 mm×120 mm size,while the microsystem is only 37 mm×37 mm size,reducing its area by 95%.Based on the integrated ceramic three-dimensional package architecture,the microsystem integrates a variety of bare chips and passive devices to realize the electrical interconnection of internal signals.A new heat dissipation scheme is adopted to customize and develop a high thermal conductivity composite heat sink cover plate.The thermal conductivity is increased from 15 W/(m·K)to 150 W/(m·K)above.The thermal conductive silica gel is filled between the FC bare chip and the cover plate to form a new heat dissipation route and achieve efficient heat dissipation.

关 键 词：一体化 微系统 射频模拟数字 三维集成 

分 类 号：TN305[电子电信—物理电子学]