芯片共晶模块高钎透率真空回流焊接工艺  

Vacuum Reflow Soldering of Chip Eutectic Module with High Soldering Penetration Rate

作　　者：李强[1] 吴昱昆 汪锐[1] LI Qiang;WU Yukun;WANG Rui(The 38th Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230088

出　　处：《电子工艺技术》2023年第3期17-20,共4页Electronics Process Technology

基　　金：安徽省重点研究与开发计划(202104g01020014)。

摘　　要：芯片共晶模块是微波组件的重要组成部分,芯片共晶模块到壳体封装质量直接影响微波组件的电学性能和可靠性。采用真空回流焊接技术对芯片共晶模块进行低温焊接,通过优化压块材质、温度曲线和真空制程参数等方式,实现芯片共晶模块焊接钎透率达90%以上、单个空洞率低于5%的标准要求。The chip eutectic module is the key section of microwave component,and the packaging quality from the chip eutectic module to the shell directly affects the electrical performance and reliability of microwave components.The vacuum refl ow soldering technology is used to weld the chip eutectic module at low temperature.By optimizing pressing material,temperature curve and vacuum profile,the standard requirements that the soldering penetration rate of the chip eutectic module is more than 90%and the single void rate is less than 5%are achieved.

关 键 词：芯片共晶模块 真空回流焊接 低温焊接 钎透率 

分 类 号：TN405[电子电信—微电子学与固体电子学]