高频电路基板阻焊创新工艺  

Innovative Technology for Solder Mark on High-frequence Circuit Substrates

作　　者：李传平 江芸[1] 张彬彬 王淑琼 LI Chuanping;JIANG Yun;ZHANG Binbin;WANG Shuqiong(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《电子工艺技术》2023年第3期50-54,共5页Electronics Process Technology

摘　　要：绿油是一种常用的高温涂覆阻焊材料,但在微波电路、天线、功率电子等高频段电子工作时,具有较强影响而不能适用,会引起少锡、溢流、短路及损耗大的问题。为有效解决此问题,研究了一种通过水溶性阻焊胶的高频电路基板阻焊技术。通过样件设计,验证了这种技术不影响焊接效果且焊后容易去除。对环境试验后的样件进行推力测试、阻抗测量、染色试验和金相分析,证明了其应用可靠性。As one of a commonly used high-temperature coating for solder mask,Green ink is not applicable due to its strong influence on high-frequency electronics such as microwave circuit,antenna and power electronics,which can cause problems such as solder lack,overflow,bridging and large loss happening.For solving the problem effectively,a high frequency circuit substrate solder mask technology using water-soluble solder mask is studied.Through sample design,it was verified that this technology does not affect the soldering quality and is easy to remove after soldering.The application reliability is comfi rmed by thrust test,resist measurement,dye experiment,metallographic analysis for the samples after environmental test.

关 键 词：高频电路 水溶性阻焊胶 可靠性 

分 类 号：TN605[电子电信—电路与系统]