一种模块化电子机箱结构及热设计  

Structural and Thermal Design of a Modular Electronic Case

作　　者：康鹏 徐国梁 王森 王锡鑫 KANG Peng;XU Guoliang;WANG Sen;WANG Xixin(The 22nd Research Institute of China Electronics Technology Group Corporation,Qingdao 266107,China)

机构地区：[1]中国电子科技集团公司第二十二研究所,山东青岛266107

出　　处：《新技术新工艺》2023年第4期29-32,共4页New Technology & New Process

摘　　要：军用电子设备集成化越来越高,设备结构日趋复杂,在满足电子设备正常稳定工作的背景下,设计效率高、迭代方便、经济性好的机箱结构成为赢得市场的关键。通过对机箱内结构件与电路板的组合设计提出一种集成化、模块化程度高的机箱结构,进行了合理的公差设计、工艺设计以提高电路板连接器连接的可靠性。设计了针对该机箱结构的散热方式、风道结构,并进行了热仿真分析,证明了机箱良好的散热性能。设计了内置式滑轨,通过后推拉方式打开机箱进行元器件拆装、维护。该机箱具有模块化程度高、结构紧凑、内部线缆少、散热能力强、维修便捷性好等优点,机箱研制周期短,迭代性好,具备良好的经济性。The integration of military electronic equipment has been becoming higher and higher,and the equipment structure has been becoming increasingly complex.Under the background of making sure the normal and stable operation of electronic equipment,the key to win the market was to design the chassis structure with high efficiency,convenient iteration and good economy.Through the combination design of structural parts and circuit boards in the case,a case structure with high integration and modularization was proposed.The connection reliability of circuit board connector was improved by tolerance design and process design.The heat dissipation mode and air duct structure for this case were designed,and the thermal simulation analysis was conducted which proved the good heat dispersion of the case.The case was opened by push or pull through the built-in slide rail for components and parts dismounting and maintenance.The case had the advantages of high modularity,compact structure,less internal cables,strong heat dissipation ability,good maintenance convenience.,short development cycle of the case,good iteration and good economy.

关 键 词：电子设备机箱 结构设计 模块化 滑轨 热设计 icpeak 

分 类 号：TH113[机械工程—机械设计及理论]