SiC陶瓷化学镀Ni及SiC/熔融Cu界面润湿性研究  

Electroless nickel plating on SiC ceramics and interfacial wettability of SiC and molten copper

作　　者：常佳琦 常庆明[1,2] 李可 鲍思前[1,2] 李亚伟[1,2] 王庆虎 Chang Jiaqi;Chang Qingming;Li Ke;Bao Siqian;Li Yawei;Wang Qinghu(College of Materials Science and Metallurgical Engineering,Wuhan University of Science and Technology,Wuhan 430081,China;State Key Laboratory of Refractories and Metallurgy,Wuhan University of Science and Technology,Wuhan 430081,China)

机构地区：[1]武汉科技大学材料与冶金学院,湖北武汉430081 [2]武汉科技大学省部共建耐火材料与冶金国家重点实验室,湖北武汉430081

出　　处：《武汉科技大学学报》2023年第3期186-192,共7页Journal of Wuhan University of Science and Technology

基　　金：国家重点研发计划项目(2021YFB3800501).

摘　　要：利用化学镀Ni法在SiC陶瓷表面获得镀Ni层,借助SEM、XRD、XRF及热震循环实验等对镀Ni层的微观组织、物相组成及结合性能进行表征,重点研究了熔融Cu在相关基板上的润湿性能。结果表明,在镀液温度为65℃、pH值为9、施镀时间为30 min的条件下,SiC陶瓷表面镀Ni层最佳,能显著改善熔融Cu在SiC陶瓷基板上的润湿性。Nickel coating was obtained on SiC ceramics surface via electroless nickel plating method,and the microstructure,phase composition and bondability of nickel coating were characterized by SEM,XRD,XRF and thermal shock cycling experiments.The wettability of molten copper on the relevant substrates was investigated as a focus.The results show that under the conditions of bath temperature at 65℃,pH at 9 and plating time at 30 min,the nickel coating on SiC ceramics surface is optimal and can dramatically improve the wettability of molten copper on SiC ceramics substrate.

关 键 词：化学镀NI SIC陶瓷 熔融Cu 润湿性 

分 类 号：TB333[一般工业技术—材料科学与工程]