离子束活化对GF/PEEK金属化涂层结合强度的影响  

Bonding Strength of Metallized Coatings on GF/PEEK Surface after Ion Beam Activation

作　　者：钟利 金凡亚 但敏 童洪辉 敬星 ZHONG Li;JIN Fanya;DAN Min;TONG Honghui;JING Xing(Tongchuang(Chengdu)Technology Co.of CNNC,Southwest Institute of Physics,Chengdu 610207,China;Nuclear Fuel Element and Material Sub-institute of NPIC,Nuclear Power Institute of China,Chengdu 610213,China)

机构地区：[1]核工业西南物理研究院中核同创(成都)科技有限公司,成都610207 [2]中国核动力研究设计院核燃料元件及材料研究所,成都610213

出　　处：《中国表面工程》2023年第2期86-96,共11页China Surface Engineering

基　　金：国家自然科学基金(11875039);西物创新行动(202001XWCXYD002)资助项目。

摘　　要：为了解决玻纤/聚醚醚酮复合材料(GF/PEEK)因界面惰性导致的金属化涂层结合强度弱的问题,采用低能离子束对基材进行表面活化处理,再以磁控溅射和电镀技术制备Cu膜,从而实现复合材料表面大厚度、高性能金属化层的制备。分别采用Ar、H_(2)、O_(2)和H_(2)+N_(2)混合气体进行离子束活化,通过对比活化前后基材的润湿性能、微观形貌和表面特性变化,对离子束活化的作用机理展开研究,制备Cu膜并对Cu膜的结合强度进行判定,探讨不同气体活化对结合强度的影响规律。结果表明,经离子束活化后,复合材料的表面润湿性得到显著改善,极性官能团的相对含量明显提高,表面和浅表面玻纤的结构完整性受到破坏,采用Ar、H_(2)、O_(2)和H_(2)+N_(2)离子束活化处理后,Cu膜的结合强度由未经活化的0.1MPa逐渐提高至0.4 MPa、1.49 MPa、7.97 MPa和11.51MPa。离子束活化技术能够有效改善复合材料的表面活性,显著提高金属化涂层的结合强度,延长金属化层的使用寿命,为其工程化应用奠定了理论和数据基础。GF/PEEK composites,prepared with polyetheretherketone as the substrate and glass fiber as the reinforcing phase,can balance mechanical properties with lightweight engineering needs and have become one of the most popular materials for engineering applications.However,GF/PEEK composites have poor electrical,thermal,and magnetic conductivity.Therefore,when specific functionality,such as electromagnetic shielding,filtering,and thermal radiation resistance,is required,a thin metal layer must be prepared on the surface to achieve structural–functional integration without changing the basic properties of the material.However,as the GF/PEEK composite is particularly chemically inert,it has weak molecular interactions at the interface with the metal layer and weak bond strength because of the heterogeneous material mismatch at the interface.This has limited the research and application of metallization.To address these problems,a Hall ion source is used to generate a broad,low-energy ion beam for the surface activation of the substrate,thereby improving the surface activity of the material.On this basis,a Cu conductive seed layer is deposited by DC magnetron sputtering technology,after which a Cu thickening layer is electroplated on the seed layer,thus realizing the preparation of large-thickness,high-performance metallic Cu films on the surface of composite insulating materials.For the ion beam activation,the working gases are Ar,H_(2),O_(2),and an H_(2)+N_(2) mixed gas.The mechanism of the ion beam activation is investigated by comparing the changes in the wetting properties,micromorphology,and surface properties of the substrates before and after activation with the different gases.On this basis,the Cu films are prepared,and the binding strengths of the Cu films are determined by qualitative and quantitative methods to explore the influence of the activation of the different gasses.The results showed that the structural integrity of the GF/PEEK material surface and shallow surface glass fibers is significantly disru

关 键 词：表面金属化 离子束活化 聚醚醚酮 结合强度 

分 类 号：TQ311[化学工程—高聚物工业] TQ316TQ317