高压大容量功率半导体器件技术及其应用  

Technology and application of high-voltage and large-capacity power semiconductor devices

作　　者：丁荣军 窦泽春 罗海辉 DING Rongjun;DOU Zechun;LUO Haihui(CRRC Zhuzhou Institute Co.,Ltd.,Zhuzhou,Hunan 412001,China)

机构地区：[1]中车株洲电力机车研究所有限公司,湖南株洲412001

出　　处：《机车电传动》2023年第2期1-13,共13页Electric Drive for Locomotives

基　　金：国铁集团科技研究开发计划项目(K2021J046)。

摘　　要：功率半导体器件作为电气化进程的核心组成部分,其本身在不断迭代提升,并促进电气化装置和应用的发展。功率半导体器件的关键技术主要体现在4个方面:新材料、新结构、新封装、智能化。针对不同应用的场景,功率半导体器件的要求也不尽相同,文章通过对轨道交通、电动汽车和电力系统等典型场景特点的分析,阐述了精细沟槽型绝缘栅双极型晶体管、碳化硅和高功率密度智能化集成功率器件等的应用;功率半导体器件目前仍然处于飞速且稳健的发展阶段,随着技术不断成熟,新技术的不断涌现,4个关键技术均存在巨大的发展空间。As the core component of electrification process,the power semiconductor device keeps improving,and constantly promotes the development of electrification devices and applications.The key technologies of power semiconductor devices mainly include four aspects:new material,new structure,new package and intelligence.The requirements for power semiconductor devices are different in different application scenarios.By analyzing the characteristics of typical application scenarios of rail transit,electric vehicle and electric power system,this paper analyzed and described the applications of fine trench insulated gate bipolar transistor,silicon carbide and intelligent integrated power devices with high power density.At present,power semiconductor devices are still in a rapid and steady development stage.Existing technologies are maturing and new technologies are emerging,there is a huge space for the development of key technologies in the four aspects.

关 键 词：功率半导体器件 新材料 新结构 新封装 智能化 典型应用 

分 类 号：TN303[电子电信—物理电子学]