电镀镍层光亮度影响因素研究  

Study on influencing factors of brightness of plating nickel layer

作　　者：陈世金 张立国 李云萍 韩志伟 Chen Shijin;Zhang Liguo;Li yunping;Han Zhiwei

机构地区：[1]博敏电子股份有限公司,广东梅州51400

出　　处：《印制电路资讯》2023年第3期83-88,共6页Printed Circuit Board Information

摘　　要：本文通过分析光亮镍镀层的形成机理,从镀层表面粗糙度和镀层结晶大小两个方面寻找影响电镀镍层光亮度的关键因子,并在生产过程中对这些关键影响因子加以管控,以实现对光亮电金产品表面光亮度的控制。By analyzing the formation mechanism of the bright nickel plating,we find the key factors affecting the brightness of the plating nickel layer from two aspects of the surface roughness of the coating and the crystallization size of it,and control these key factors in the production process to achieve the control of the surface brightness of the plating gold products.

关 键 词：粗糙度 镀层结晶 光亮度 

分 类 号：TQ1[化学工程]