低分子量聚苯醚改性聚酰亚胺材料的制备及性能研究  

Preparation and Properties Study of Polyimide Modified by Low Molecular Weight Polyphenylene Oxide

作　　者：陈子菁 李伟浩 钟本镔 王天帆 张梦辉 黄雪[2] CHEN Zijing;LI Weihao;ZHONG Benbin;WANG Tianfan;ZHANG Menghui;HUANG Xue(Institute of Chemical Engineering,Guangdong Academy of Sciences,Guangzhou 510665,China;Zhongkai University of Agriculture and Engineering,Guangzhou 510225,China)

机构地区：[1]广东省科学院化工研究所,广东广州510665 [2]仲恺农业工程学院化学化工学院,广东广州5102252

出　　处：《塑料工业》2023年第5期62-68,共7页China Plastics Industry

基　　金：广东省重点领域研发计划项目(2020B0101340005);广东省科学院建设国内一流研究机构行动专项资金项目(2019GDASYL-0501013)。

摘　　要：通过环氧基与聚酰胺酸的反应,用自制的环氧化聚苯醚(EPPO)改性聚酰亚胺。其中,环氧基开环使得聚酰亚胺分子链之间发生交联。通过改变环氧化聚苯醚的添加量制备了一系列的改性膜并对其介电性能、热尺寸稳定性、耐热性能等进行研究。结果表明,环氧化聚苯醚质量分数为2%的改性聚酰亚胺膜在所研究样品中具有较好的综合性能,如优异的耐热性(分解温度为493℃),较低的热膨胀系数(室温~200℃下为79.1×10^(-6)/℃)和优良的介电性能(10 GHz下介电常数为3.14、介电损耗角正切值为0.0063)。Using the reaction between the epoxy group and the polyamide acid,the polyimide was modified by self-made epoxidized polyphenylene oxide(EPPO).Due to the ring opening of the epoxy group,a cross-linking would happen between the polyimide molecular chains.A series of films were synthesized and modified with different contents of the epoxidized polyphenylene oxide and its dielectric properties,thermal dimensional stabilities,and heat resistance properties were studied.The results show that the polyimide film modified by 2%epoxidized polyphenylene oxide behaves an excellent heat resistance(the decomposition temperature is 493℃),lower thermal expansion coefficient(CTE is 79.1×10^(-6)/℃in the range of room temperature to 200℃)and good dielectric properties(the dielectric constant is 3.14 at 10 GHz,the dielectric loss tangent is 0.0063 at 10 GHz)in all studied samples.

关 键 词：环氧化聚苯醚 聚酰亚胺 改性 低分子量 

分 类 号：TQ323[化学工程—合成树脂塑料工业]