基于LTCC的X波段四通道发射SiP模块  

X-Band 4-Channel Transmitter SiP Module Based on LTCC Technology

作　　者：刘子奕 魏浩 杨文涛 韩威 赵建欣[1] 郑书利 魏恒[1] Liu Ziyi;Wei Hao;Yang Wentao;Han Wei;Zhao Jianxin;Zheng Shuli;Wei Heng(The 54th Research Institute,CETC,Shijiazhuang 050081,China)

机构地区：[1]中国电子科技集团公司第五十四研究所,石家庄050081

出　　处：《半导体技术》2023年第5期414-420,共7页Semiconductor Technology

摘　　要：面向雷达相控阵系统应用,研制了一款X波段四通道发射封装内系统(SiP)模块。SiP模块采用低温共烧陶瓷(LTCC)基板,共28层,设计最小线宽为150μm,且内置埋阻。模块集成了驱动放大器、低噪声放大器(LNA)、幅相多功能等芯片,并将四功分器和交叉带状线网络设计于基板内部,提高了模块的集成度和通道间隔离度,采用内部互连的LTCC基板实现了多种有源器件和无源结构的三维集成。测试结果表明,在工作频率9~10.5 GHz,SiP模块单通道增益≥37 dB,输出功率可达24 dBm,通道间隔离度≥25 dB。SiP模块尺寸仅为20 mm×20 mm×2.65 mm,质量约3.35 g。实现了X波段多通道SiP模块的高性能、高集成度和小型化,可广泛应用于相控阵雷达的T/R组件中。For the application of phased array radar system,an X-band 4-channel transmitter system in package(SiP)module was designed and fabricated.The SiP module was realized by using 28-layer low temperature co-fired ceramic(LTCC)substrate with the minimum design line width of 150μm and buried resistors.Various chips including driver amplifier,low noise amplifier(LNA),multi-function chip with phase and amplitude control were integrated in the module.4-way power dividers and crossstripline networks were designed between the substrate layers,improving the module integration and interchannel isolation.The three-dimensional integration of a variety of active devices and passive structures was realized with internal interconnected LTCC substrate.Test results show that at the operating frequency of 9-10.5 GHz,the gain of each channel of the SiP module is≥37 dB,the output power can reach 24 dBm,and the channel isolation is≥25 dB.The size of the SiP module is 20 mm×20 mm×2.65 mm,and the mass is about 3.35 g.The high performance,high integration and miniaturization of the X-band multi-channel SiP module are realized,which can be widely applied in T/R modules of phased array radar.

关 键 词：低温共烧陶瓷(LTCC) X波段 四通道 高集成度 封装内系统(SiP) 

分 类 号：TN454[电子电信—微电子学与固体电子学]