高速差分过孔的排布优化及信号完整性分析  

Layout Optimization and Signal Integrity Analysis of High-speed Differential Vias LIU Guangfu ZHOU Lusha ZENG Aijing DING Yifu ZHANG Gangao ZHONG Peisen

作　　者：刘光福 周璐莎 曾艾婧 丁一夫 张港澳 钟沛森 佘海军 刘喆 吴子乾 SHE Haijun;LIU Zhe;WU Ziqian(China Automotive Research Institute Automotive Inspection Center(Guangzhou)Co.,Ltd.,Guangzhou,Guangdong Province,511340 China)

机构地区：[1]中汽研汽车检验中心(广州)有限公司,广东广州511340

出　　处：《汽车知识》2023年第5期14-17,共4页Auto Know

摘　　要：汽车逐渐向电动化、智能化快速发展,5 nm的高通8295旗舰芯片也开始逐步应用于传统汽车与新能源汽车设计,这对信号的高质量传输提出了更高的要求。该文首先介绍了插损串扰比和集成串扰噪声的信号质量评估方法,然后提出了信地比分别为1∶2和2∶3的两种差分过孔优化排布方案。数据结果表明,新差分过孔排布结构的性能提升显著,可以为信号的高质量传输提供可靠的解决方案。With the rapid development of cars towards electrification and intelligence,5nm Qualcomm 8295 flagship chip has also been gradually applied to the design of traditional and new energy vehicles,which puts forward higher requirements for high-quality signal transmission.In this paper,the signal quality evaluation methods of the Insertion loss to crosstalk ratio and the integrated crosstalk noise were explored.In addition,two kinds of differential via optimization schemes with the signal-ground ratio of 1:2 and 2:3 were proposed respectively.The data results show that the performance of the new differential via structure is improved significantly,which provides a reliable solution for high-quality signal transmission.

关 键 词：信号完整性 信地比S∶G 集成串扰噪声ICN 插损串扰比ICR 

分 类 号：U463.62[机械工程—车辆工程]