浇铸温度对于Cu/Al复合板界面的影响  

Effect of Casting Temperature on Interface of Cu/Al Composite Plate

作　　者：卢山 周晨 许光明 李勇[2] Lu Shan;Zhou Chen;Xu Guangming;Li Yong(Key Laboratory of Electromagnetic Processes of Materials(Ministry of Education),Northeastern University,Shenyang 110819,China;State Key Laboratory of Rolling and Automation,Northeastern University,Shenyang 110819,China)

机构地区：[1]东北大学材料电磁过程研究教育部重点实验室,辽宁沈阳110819 [2]东北大学轧制技术及连轧自动化国家重点实验室,辽宁沈阳110819

出　　处：《有色金属加工》2023年第3期8-13,共6页Nonferrous Metals Processing

基　　金：国家自然基金资助项目(51790485);南宁市科技重大专项项目(20201041)。

摘　　要：研究不同浇铸温度下Cu/Al复合板复合界面处化合物层变化及对于剥离强度的影响;确定理想的浇铸温度,得到剥离强度较高的复合界面。结果表明,当熔体压力、铜带厚度、铸轧速度一定时,随着浇铸温度的升高界面处扩散层的厚度逐渐增加,Cu带变形量逐渐降低,界面剥离强度降低。当浇铸温度为700℃时,界面扩散层为2.4μm,界面化合物厚度为0.3μm,剥离强度为36.5N/mm。In this paper,the change of compound layer at the interface of Cu/Al composite plate and its effect on the peeling strength at different casting temperatures are studied.The ideal casting temperature is determined to obtain the composite interface with high peeling strength.The results show that when the melt pressure,the thickness of the copper strip and the casting and rolling speed are constant,the thickness of the diffusion layer at the interface increases gradually with the increase of the casting temperature,the deformation of the Cu strip decreases gradually,and the interface peeling strength decreases.When the casting temperature is 700℃,the interfacial diffusion layer is 2.4μm,the interfacial compound thickness is 0.3μm,and the peeling strength is 36.5N/mm.

关 键 词：Cu/Al复合板 浇铸温度 界面 化合物层 剥离强度 

分 类 号：TG29[金属学及工艺—铸造]