玻璃料对Si_(3)N_(4)改性硼酚醛树脂复合材料高温性能及其介电性能的影响  

Influence of glass frit on high temperature properties and dielectric properties of Si_(3)N_(4)modified boron phenolic resin composites

作　　者：韩朋坤 邓宗义 李鹏飞 杨婷莅 万立[1] 董闯 石敏先[1] HAN Pengkun;DENG Zongyi;LI Pengfei;YANG Tingli;WAN Li;DONG Chuang;SHI Minxian(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China)

机构地区：[1]武汉理工大学材料科学与工程学院,武汉430070

出　　处：《复合材料学报》2023年第5期3037-3046,共10页Acta Materiae Compositae Sinica

基　　金：上海航天科技创新基金(SAST2018-067)。

摘　　要：为了探究助熔剂对树脂基复合材料高温性能及微观结构的影响,以低熔点玻璃料(GF)为助熔剂,Si_(3)N_(4)颗粒为耐高温陶瓷填料,采用模压工艺制备GF-Si_(3)N_(4)改性高硅氧玻璃纤维增强硼酚醛树脂复合材料(GFSi_(3)N_(4)/BPR),研究GF对复合材料高温性能及介电性能的影响。结果表明:引入的GF促进了复合材料表面液相的形成和陶瓷层的致密化,抑制了热氧对复合材料的进一步侵蚀,复合材料高温性能明显提高。1200℃处理后,其弯曲强度与纯树脂试样(BPR)和未添加GF的试样(Si_(3)N_(4)/BPR)相比,分别提高了81.3%和14.9%;质量烧蚀率分别降低了73.1%和55.1%。此外,在8.2 GHz下,复合材料的介电常数(ε)和损耗角正切值(tanδ)随温度的升高逐渐增大。而在800℃以上,生成的玻璃相有效遏制了树脂裂解产生的游离碳与孔洞、裂纹对材料介电性能的不利影响。所制备的复合材料具有优良的高温性能和介电性能,有望应用在高温透波领域。To investigate effect of flux on properties and microstructure of resin matrix composites at elevated temperature,glass frit(GF)and Si_(3)N_(4)modified high silica glass fiber reinforced boron phenolic resin composites(GFSi_(3)N_(4)/BPR)were prepared via a compression molding technique using low melting point GF as flux and Si_(3)N_(4)particles as high temperature resistant fillers.The influence of GF on the high temperature properties and dielectric properties of composites was studied.The results show that the introduced GF promotes the formation of liquid phase on the surface of composites and the densification of the ceramic layer,inhibiting erosion of composites by oxygen at elevated temperatures and significantly improving the high temperature performance of composites.The flexural strength of GF-Si_(3)N_(4)/BPR treated at 1200℃was increased by 81.3%and 14.9%,respectively,compared with high silica glass fiber reinforced boron phenolic resin composites(BPR)and Si_(3)N_(4)modified high silica glass fiber reinforced boron phenolic resin composites(Si_(3)N_(4)/BPR),while the mass ablation rate was reduced by 73.1%and 55.1%,respectively,compared with BPR and Si_(3)N_(4)/BPR.Furthermore,at 8.2 GHz,the dielectric constant(ε)and loss tangent(tanδ)of the composites gradually increased with increasing temperature.At temperatures above 800°C,the resulting glass phase effectively restrains the adverse effects of free carbon,pores,and cracks generated by resin cracking on the dielectric properties of the material.The prepared composite material has excellent high temperature properties and dielectric properties,and is expected to be applied in the field of high temperature wave transmission.

关 键 词：Si_(3)N_(4) 耐高温 耐烧蚀 微观结构 介电性能 可陶瓷化复合材料 

分 类 号：TB332[一般工业技术—材料科学与工程]