一种用于数据中心冷却的空气换热器的设计与模拟  

Design and Numerical Simulation of an Air Handling Unit Heat Exchanger for Data Center Cooling

作　　者：刘斌 耿士江 王子星 陶文铨 Liu Bin;Geng Shijiang;Wang Zixing;Tao Wenquan(Zhejiang Extek Technology Co.,Ltd.,Huzhou,313300,China;Key Laboratory of Thermal Fluid Science and Engineering of MOE,School of Energy and Power Engineering,Xi′an Jiaotong University,Xi′an,710049,China)

机构地区：[1]浙江英特科技股份有限公司,湖州313300 [2]西安交通大学能源与动力工程学院热流科学与工程教育部重点实验室,西安710049

出　　处：《制冷学报》2023年第3期150-157,共8页Journal of Refrigeration

基　　金：国家自然科学基金(51721004)资助项目;西安市科技局项目(2019218714SYS002CG024)资助

摘　　要：本文提出一种应用于数据中心场景的空气冷却器的换热板片设计,介绍了板片的设计思路并对板片间空气流动传热特性进行了数值仿真。利用圆台型丁胞以及不同凹凸方向的棒状丁胞阵列等丁胞结构进行强化传热,并通过数值模拟方法分析了改进芯片的强化传热效果。结果表明:雷诺数Re越高,改进板片的强化传热效果越好,其中改进芯片3在Re为15091时相对于原始板片可实现等泵下强化传热37%,在Re为5000时也能实现强化传热20%。对比不同改进板片,发现棒状丁胞阵列的长轴方向及凹凸方向对强化传热效果影响较大,Re为15091时,通过调节棒状酒窝阵列的布置方式后得到的改进板片3相较于改进板片1可在等泵功下强化传热11%以上。This study proposed a heat exchanger plate design scheme for an air handling unit used in a data center.In this study,the thin plate design idea was introduced step by step,and the flow and heat transfer performance were investigated using a numerical model.Circular estrade dimple and rod-shaped dimple arrays with different concave and convex directions were applied to the plates to enhance heat transfer.The numerical results show that the improved plates have a better heat transfer enhancement effect at larger Reynolds numbers(Re).When the Re is 15091,compared with the baseline plate,the improved plate 3 enhances the heat transfer by 37%at the same pumping power,while the improved plate 3 enhances the heat transfer by 20%at Re of 5000.It is found that the axial direction and the transverse directions of the rod-shaped dimple array have a significant influence on the enhancement of heat transfer.When the Re is 15091,compared with the improved plate 1,the improved plate 3 enhances the heat transfer by more than 11%at the same pumping power,by adjusting the arrangement of the rod-shaped dimple array.

关 键 词：数据中心 强化传热 丁胞结构 数值模拟 

分 类 号：TB611[一般工业技术—制冷工程] TK172[动力工程及工程热物理—热能工程] TP308[自动化与计算机技术—计算机系统结构]