电子封装外壳均匀性及差异性电镀方案设计  

Design of uniform and differential electroplating process for electronic package shell

作　　者：胡竹松[1] 马骁 唐正生 杨磊[1] 陈华三[1] 李凯旋 吕璐阳 HU Zhusong;MA Xiao;TANG Zhengsheng;YANG Lei;CHEN Huasan;LI Kaixuan;LYU Luyang(The 43rd Research Institute of CETC,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088

出　　处：《电镀与涂饰》2023年第11期37-42,共6页Electroplating & Finishing

摘　　要：介绍了电子封装外壳均匀性及差异性电镀的设计方案。通过旋转电镀实现电子封装外壳镀层均匀性的要求,采用双电源方式实现封装外壳镀层差异性的要求。The scheme for uniform and differential electroplating on the surface of electronic package shell was introduced.The requirement of coating uniformity on package shell was achieved through rotating plating,while the requirement of differential coating thickness was realized by using dual power supply.

关 键 词：电子封装外壳 旋转电镀 金 镍 均匀性 差异性 双电源 

分 类 号：TQ153.12[化学工程—电化学工业] TQ153.18