软熔和钝化工艺参数对镀锡板印铁涂布缩孔的影响  

Effects of process parameters of reflowing and passivation on shrinkage defect during coating and printing of tinplate

作　　者：万一群[1] 齐韦 吴明辉 段宗灿 尹显东[1] 沈鹏杰 WAN Yiqun;QI Wei;WU Minghui;DUAN Zongcan;YIN Xiandong;SHEN Pengjie(Shougang Jingtang United Iron&Steel Co.,Ltd.,Tangshan,063200,China;Shanghai Wubao Mechatronic Technology Co.,Ltd.,Shanghai 200940,China)

机构地区：[1]首钢京唐钢铁联合有限责任公司,河北唐山063200 [2]上海务宝机电科技有限公司,上海200940

出　　处：《电镀与涂饰》2023年第11期58-66,共9页Electroplating & Finishing

摘　　要：针对镀锡板印铁涂布时出现漆膜缩孔问题,通过X射线光电子能谱(XPS)和电化学测试技术研究了软熔和钝化工艺参数对镀锡板表面张力及表面镀层、氧化膜和钝化膜物质组成的影响。结果表明:升高软熔温度或增大软熔高度都能够提高钝化膜对氧化膜的覆盖率,增大钝化电流密度则能够增大钝化膜中Cr2O3的含量,都有利于减少印铁涂布的缩孔缺陷。As for the shrinkage defects appearing on the paint during coating and printing of tinplate,the effects of process parameters of reflowing and passivation on the surface tension of tinplate and the compositions of tin coating,oxide film,and passivation film were studied by X-ray photoelectron spectroscopy(XPS)and electrochemical measurement.The results showed that the coverage rate of passivation film on oxide film was increased with the increasing of reflowing temperature or reflowing height,and the content of Cr_(2)O_(3)in passivation film could be increased by increasing the current density of passivation,facilitating the reduction of shrinkage defects during coating and printing of tinplate.

关 键 词：镀锡板 印铁涂布 缩孔缺陷 表面张力 软熔 钝化 

分 类 号：TQ153.13[化学工程—电化学工业]