CO_(2)激光直写PI薄膜温度、应力场仿真与分析  

Simulation and analysis of temperature and stress field of direct-written PI films by CO_(2) laser

作　　者：张华忠[1] 李世琛 钟勉 邹瑶 蒋勇[3] ZHANG Huazhong;LI Shichen;ZHONG Mian;ZOU Yao;JIANG Yong(Institute of Electronic and Electrical Engineering,Civil Aviation Flight University of China,Guanghan 618307,Sichuan Province,China;Institute of Civil Aviation Intelligent Sensing and Advanced Detection Technology,Civil Aviation Flight University of China,Guanghan 618307,Sichuan Province,China;School of Mathematics and Physics,Southwest University of Science and Technology,Mianyang 621010,Sichuan Province,China)

机构地区：[1]中国民用航空飞行学院航空电子电气学院,四川广汉618307 [2]中国民用航空飞行学院民航智能感知与先进检测技术研究所,四川广汉618307 [3]西南科技大学数理学院,四川绵阳621010

出　　处：《电子元件与材料》2023年第5期560-567,共8页Electronic Components And Materials

基　　金：国家自然科学基金面上项目(11972313);四川省通用航空器维修工程技术研究中心项目(GAMRC2021YB12);中国民用航空飞行学院重点项目(ZJ2021-04)。

摘　　要：CO_(2)激光直写诱导碳基前驱体生成石墨烯过程中,温度与应力是影响石墨烯生成质量的主要因素。利用COMSOL Multiphysics仿真软件,建立连续CO_(2)激光作用于聚酰亚胺(PI)薄膜温度场与应力场模型,研究激光功率、光斑直径、扫描速度对平均升温速率(δ)及热应力的影响,并根据石墨烯生成温度阈值与薄膜受损温度阈值筛选出合理参数范围。仿真结果表明:在重复扫描策略下,薄膜正面平均升温速率δ1与激光功率呈线性正相关关系,与光斑直径呈指数下降关系,与扫描速度呈幂函数单调递减关系,δ1的较优范围为93.6℃/s≤δ_(1)≤147.8℃/s;背面平均升温速率δ2与激光功率呈线性正相关规律,与光斑直径呈二次函数单调递减规律,与扫描速度呈线性负相关规律,δ2的较优范围为69.5℃/s≤δ_(2)≤86.9℃/s。激光功率是影响热应力的主要因素,仿真结果与结论可为PI薄膜激光诱导石墨烯研究提供参考。Temperature and stress are the main factors affecting the quality of graphene formation in the process of carbon based precursor formation,which is induced by CO_(2) laser direct-written.The COMSOL Multi-physics simulation software was used to establish the temperature and stress field model of polyimide(PI)film,which was treated by continuous CO_(2) laser.The effects were studied for laser power,spot diameter,scanning speed on average heating rate(δ)and thermal stress.The reasonable parameter range was screened out according to graphene generation and film damage temperature threshold.The simulation results show that the average heating rate of the front of the film(δ1)is linearly and positively correlated with the laser power,which exponentially decreases with the spot diameter,and monotonically decreases with the scanning speed under the repeated scanning strategy.The optimal range is 93.6≤δ_(1)≤147.8(℃/s).The average heating rate on the back(δ2)is linearly and positively correlated with the laser power,monotonically decreased with the spot diameter as a quadratic function,and linearly and negatively correlated with the scanning speed.The optimal range is 69.5≤δ_(2)≤86.9(℃/s).The laser power is the main factor affecting the thermal stress.The simulation results and conclusions can provide reference for the study of laser induced graphene fabrication on PI films.

关 键 词：CO_(2)激光直写 PI薄膜 COMSOL Multiphysics 温度场 应力场 

分 类 号：TN249[电子电信—物理电子学]