金刚石一次粒径对固结聚集体金刚石磨料垫加工性能与磨损过程的影响  

Effect of Primary Diamond Grain Size on Lapping Performance and Wear Process of Fixed Agglomerated Diamond Abrasive Pads

作　　者：牛凤丽 王科荣 任闯 刘宁 朱楠楠[1,2] 朱永伟[1,2] NIU Feng-li;WANG Ke-rong;REN Chuang;LIU Ning;ZHU Nan-nan;ZHU Yong-wei(College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Jiangsu Key Laboratory of Precision and Micro-manufacturing Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;Mechanical&Electrical Engineering College,Jinhua Polytechnic,Zhejiang Jinhua 321000,China)

机构地区：[1]南京航空航天大学机电学院 [2]南京航空航天大学江苏省精密与微细制造技术重点实验室,南京210016 [3]金华职业技术学院机电工程学院,浙江金华321000

出　　处：《表面技术》2023年第6期351-360,共10页Surface Technology

基　　金：国家自然科学基金联合基金(U20A20293)。

摘　　要：目的探究金刚石颗粒的一次粒径对固结聚集体金刚石磨料垫磨损的影响规律,提高固结磨料垫的自修整、加工性能及经济耐用度。方法选择14、8、5、1μm等4种粒度的金刚石颗粒,采用烧结法制备聚集体金刚石磨料,并将其用于制备固结聚集体金刚石磨料垫。在CP-4抛光测试系统平台上开展研磨试验,在线获取加工过程中的力信号和摩擦因数。对比4种粒径的固结聚集体金刚石磨料垫的磨损速率、研磨比、研磨前后磨料垫的微观形貌、碎屑的形貌及尺寸分布,分析固结磨料垫的磨损过程及其演变规律。结果随着金刚石颗粒粒径的增大,固结聚集体金刚石磨料垫的磨损速率由0.2μm/min(金刚石颗粒为1μm)增加到3.5μm/min(金刚石颗粒为14μm),研磨比由2.02增加至14.33。大粒径(≥5μm)的固结磨料垫研磨后,表面仍有锋利的金刚石微切削刃,研磨过程中的切向力和摩擦因素保持稳定,固结聚集体金刚石磨料垫的磨损形式以金刚石颗粒的脱落为主;超细粒径(≤1μm)固结磨料垫表面的金刚石颗粒出现堵塞现象,并且研磨过程中的切向力和摩擦因数持续下降。结论随着金刚石颗粒的一次粒径增大,固结聚集体金刚石磨料垫的磨损速率增加,自修整能力、材料去除能力和加工过程稳定性得到提升,进入稳定磨损期的时间缩短。Fixed abrasive lapping,with the advantages of high material removal rate,excellent processed surface quality,and green environmental protection,is widely used in the lapping and polishing processing of semiconductor materials and optical glass,like SiC,GaN,sapphire,AlN,BK7 glass,fused silica glass,etc.For Fixed Abrasives(FA)Pads,as the lapping tools,its wear modes and wear process mechanism determine the stability of lapping process.Diamond grain sizes directly affect the lapping performance and wear behaviors.The work aims to investigate the effect of the primary diamond grain size on the wear mechanism of Fixed Agglomerated Diamond Abrasive(FADA)pads,and to improve the self-conditioning,lapping process stability and economic durability of the pads.The diamond grains with four sizes of 14μm,8μm,5μm,1μm,were selected to prepare the agglomerated diamond(AD)abrasives by sintering method.The four types of AD abrasives were used to prepare the hydrophilic resin-based FADA pads on the platen vulcanizer.The lapping tests were carried out on the CP-4 polishing platform which acquired lapping forces and friction factors during lapping process and coordinates of workpiece in Z direction.BK7 glass was selected as the workpiece with the diameter of 76.2 mm and the thickness of 5 mm.The wear rates and lapping ratios of FADA pads were calculated,the morphologies of pads before and after lapping were observed by a scanning electron microscope,and the size distribution of debris was detected by BT-2800 Dynamic Image Particle Size Analysis System.The wear process(wear thickness of pads vs material removal thickness of BK7 glass)of FADA pads was analyzed.The experimental results indicated that the wear rate of FADA pads increased from 0.2μm/min to 3.5μm/min when the primary diamond grain size increased from 1μm to 14μm.From the morphologies of FADA pads before and after lapping,the surface of FADA pads after lapping still had sharp micro-cutting-edges when the diamond grain size was above 5μm.The main wear mode was the f

关 键 词：一次粒径 聚集体金刚石磨料 固结磨料垫 磨损速率 磨损机制 

分 类 号：TG73[金属学及工艺—刀具与模具] TG74