基于单颗磨粒划擦蓝宝石的磨屑形态仿真  

Grinding chipmorphology simulation based on single abrasive scratching sapphire

作　　者：程蔚 方从富[1] CHENG Wei;FANG Congfu(College of Mechanical Engineering and Automation,Huaqiao University,Xiamen 361021,China)

机构地区：[1]华侨大学机电及自动化学院,福建厦门361021

出　　处：《福建工程学院学报》2023年第3期301-306,共6页Journal of Fujian University of Technology

基　　金：国家自然科学基金面上项目(52275426)。

摘　　要：采用有限元(FE)耦合光滑粒子流体动力学(SPH)方法,基于单颗磨粒划擦蓝宝石三维仿真模型模拟磨屑成形与形态变化。结果表明:磨屑是由材料体积压力减小而形成,存在堆积、团簇、飞溅、分层4种形态,磨屑飞溅角度在7.4°~34.3°之间变化;磨粒速度的增大使材料出现小崩碎、大崩碎和片状去除的形式,导致磨屑飞溅数量随磨粒速度呈波动变化,而与磨粒切深呈线性增大;磨屑飞溅体积随磨粒切深增大而急剧增大,随磨粒速度增大而急剧减小。该研究为后续优化磨削加工参数以及进一步探讨蓝宝石的材料去除机理提供参考。Based on the FE coupled SPH algorithm,a three-dimensional simulation model of a single abrasive grinding sapphire was established to simulate the formation and morphological changes of grinding chips.Simulation results show that the formation of chips is caused by the decrease of material bulk pressure.There are four forms of chips,i.e.,accumulation,cluster,splash and stratification,and the splash angle of chips varies from 7.4°to 34.3°.With the increase of abrasive velocity,the material will appear in the form of small broken pits,large broken pits and flake removal,which leads to the amount of abrasive splash fluctuates with abrasive velocity,and increases linearly with the abrasive cutting depth.The splash volume increases sharply with the increase of abrasive cutting depth,but decreases sharply with the increase of abrasive velocity.This study provides reference for further optimization of grinding parameters and further development of material removal mechanism of sapphire.

关 键 词：有限元 SPH 蓝宝石 磨屑形态 单磨粒加工 

分 类 号：TG58[金属学及工艺—金属切削加工及机床]