Thermal stability of polyphenylsilsesquioxane-modified meta-aramid insulation paper  

作　　者：Chao Tang Wei Zheng Lihan Wang Jufang Xie 

机构地区：[1]College of Engineering and Technology,Southwest University,400715 Chongqing,People's Republic of China

出　　处：《High Voltage》2020年第3期264-269,共6页高电压（英文）

基　　金：the National Key R&D Program of China(grant no.2017YFB0902700 and 2017YBF0902702);National Natural Science Foundation of China(grant no.51977179).

摘　　要：The development of new materials for use in advanced distribution transformers is required to improve their heat resistance rating,operational safety,and reliability.The combination of polymer and nanoparticles is the preferred approach to improve the thermal stability of materials.In this study,the thermal stability of laboratory-prepared meta-aramid insulation paper modified with polyphenylsilsesquioxane(PPSQ)was evaluated.The results showed that the thermal stability of the modified insulation paper was superior to that of the unmodified paper.Molecular dynamics simulations were used to analyse the internal mechanism of the performance improvement achieved by modification with PPSQ.From a microscopic perspective,the addition of PPSQ provided a relatively larger structural space for the meta-aramid fibre and increased the free volume of the entire system,which tightened the meta-aramid fibre molecular chains,increased the density of the structure of the paper,and enhanced the mutual permeability between meta-aramid fibre chains.Therefore,the stress can be better transmitted,the performance loss such as phase delamination was effectively prevented,and the bonding between the meta-aramid fibres was strengthened.

关 键 词：STABILITY INSULATION FIBRE 

分 类 号：TM21[一般工业技术—材料科学与工程]