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作 者:杨小乐[1] 周峰[1] 史漫丽[1] 刘伟[2] 刘彦杰[3] 刘义良[1] YANG Xiaole;ZHOU Feng;SHI Manli;LIU Wei;LIU Yanjie;LIU Yiliang(Beijing Institute of Space Mechanics&Electricity,Beijing 100011,China;North China Institute of Optoelectronic Technology,Beijing 100011,China;Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing 100011,China)
机构地区:[1]北京空间机电研究所,北京100011 [2]华北光电技术研究所,北京100011 [3]中国科学院理化技术研究所,北京100011
出 处:《红外技术》2023年第6期567-574,共8页Infrared Technology
摘 要:随着红外遥感技术的发展,航天各类应用对红外探测器阵列规模的需求已经超出了目前单模块探测器研制极限,需要通过光学或者机械拼接方法解决该问题。结合国内外先进的机械拼接技术,针对8模块超长线列拼接红外探测器研制,本文提出了拼接结构的4个设计要点和对探测器成像的影响,结合设计要点详细介绍拼接结构具体设计过程以及设计结果,最后给出拼接结构的测试方法以及一种非接触的平面度测试方法和测试结果。With the development of infrared remote sensing technology,the demand for infrared detector arrays in various aerospace applications has exceeded the current developmental limit of single-module detectors.This problem needs to be solved by optical or mechanical splicing methods.Based on an advanced mechanical splicing technology,this study presents four design points of splicing structure and their influence on detector imaging for the development of an 8-module ultra-long linear splicing infrared detector.The specific design process of the design points and design results of the splicing structure are introduced in detail.The method for testing a splicing structure and a non-contact flatness test method are described;the test results are presented.
分 类 号:TN215[电子电信—物理电子学]
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