Precise multi‐dimensional temperature‐rise characterisation of switchgear based on multi‐conditional experiments and LPTN model for high‐capacity application  

作　　者：Xiaorui Wang Haotian Xia Zhanqing Yu Yonggang Guan Biao Zhao Yulong Huang Lu Qu Jiudong Ding 

机构地区：[1]State Key Lab of Power Systems(Department of Electrical Engineering),Tsinghua University,Beijing,China [2]DC Research Center,Energy Internet Institute,Tsinghua University,Beijing,China [3]Nanjing Hezhi Electric Co.Ltd,Nanjing,China

出　　处：《High Voltage》2021年第1期138-148,共11页高电压（英文）

基　　金：National Natural Science Foundation of China,Grant/Award Number:51922062;National Key Research and Development Program,Grant/Award Number:2018YFB0904600。

摘　　要：As the power load increases, the capacity of switchgear becomes larger so the problem of overheating of switchgears becomes more significant. Whether the switchgears operate safely and reliably affects the reliability and economy of the entire power system. Different methods have been tried to study the thermal problems of switch-gears. However, there are few experimental studies on the switchgear entity. In this study, a series of temperature rise tests were carried out on medium‐voltage high‐ca-pacity switchgear to explore laws of temperature rise. First, five groups of multi‐con-ditional experiments were carried out including changes of the load current, ventilation conditions and loop resistance. Then, multi‐dimensional temperature‐rise characterisa-tion was analysed based on the experimental results and the relating theory. Finally, a circuit‐based lumped‐parameter thermal network (LPTN) model was developed by analysing the heat dissipation in switchgear and used to determine the steady‐state temperature distribution of the switchgear. The model is verified by comparing the simulation results with the experimental results.

关 键 词：APPLICATION CHARACTER switch 

分 类 号：TM564[电气工程—电器]