复配表面活性剂对新型阻挡层抛光液抛光性能的影响  

Effect of Compound Surfactant on the Polishing Performance of the Novel Barrier Slurry

作　　者：栾晓东 樊硕晨 贾儒 刘童亲 张拓 陆伟航 Luan Xiaodong;Fan Shuochen;Jia Ru;Liu Tongqin;Zhang Tuo;Lu Weihang(School of Electronic Engineering,Jiangsu Ocean University,Lianyungang 222005,China;Jiangsu Institute of Marine Resources Development,Lianyungang 222005,China)

机构地区：[1]江苏海洋大学电子工程学院,江苏连云港222005 [2]江苏省海洋资源开发研究院,江苏连云港222005

出　　处：《微纳电子技术》2023年第5期803-809,共7页Micronanoelectronic Technology

基　　金：国家自然科学基金(62104087);国家中长期科技发展规划科技重大专项资助项目(2016ZX02301003);江苏省自然科学青年基金项目(BK20191005);江苏省高等学校自然科学研究面上项目(19KJB430011)。

摘　　要：针对新型阻挡层抛光液存在Cu和正硅酸乙酯(TEOS)抛光速率一致性差、运输贮存过程中细菌滋生造成抛光表面缺陷的问题,选取脂肪醇聚氧乙烯醚(AEO)非离子表面活性剂和作为杀菌剂的阳离子表面活性剂十二烷基二甲基苄基氯化铵(DDBAC),通过复配2种表面活性剂研究其对Cu和TEOS抛光速率一致性以及杀菌效果的影响,并阐述相关的影响机制。实验结果表明:Cu和TEOS抛光速率随着复配表面活性剂体积分数的增加而降低,复配表面活性剂主要控制测量点到晶圆中心的距离为70~150 mm区域内的铜抛光速率,对于TEOS,复配表面活性剂主要控制0~70 mm区域内的铜抛光速率;复配表面活性剂体积分数的增加可同时提高Cu和TEOS抛光速率一致性,但高体积分数复配表面活性剂可造成表面划伤;DDBAC作为非氧化性的杀菌剂,具有较强的抗菌抑菌能力,可通过改变细菌膜通透性,使细菌裂解死亡,杀菌效果显著。For the problems of poor polishing rate uniformity of Cu and tetraethyl orthosilicate(TEOS)for the novel barrier slurry and surface defects caused by bacterial breeding during transportation and storage,the fatty alcohol polyoxyethylene ether(AEO)nonionic surfactant and dodecyl dimethyl benzyl ammonium chloride(DDBAC)cationic surfactant as a bactericide were selected,and the effects of two compound surfactants on the polishing rate uniformity of Cu and TEOS and bactericidal effect were studied and the relevant influencing mechanism was described.The experiment result shows that the Cu and TEOS polishing rate decreases with the increase of the volume fraction of compound surfactant,and the compound surfactant mainly controls the copper polishing rate in the 70-150 mm region from the measuring point to the wafer center.For TEOS,the compound surfactant mainly controls the copper polishing rate in the 0-70 mm region.The polishing rate uniformity of Cu and TEOS can be improved by increasing the volume fraction of compound surfactant at the same time,but the compound surfactant with high volume fraction can cause surface scratches.As a non-oxidizing biocide,DDBAC has strong antibacterial and bacteriostatic ability and can cause bacterial lysis and death by changing the permeability of bacterial membrane,so has a remarkable bactericidal effect.

关 键 词：化学机械抛光(CMP) 阻挡层抛光 复配表面活性剂 抛光速率一致性 杀菌剂 

分 类 号：TN305.2[电子电信—物理电子学]