Effect of Particle Size on Silicon Nitride Ceramic Slurry by Stereolithography  

作　　者：汪春柳 ZHANG Jinyong 雷丽文 WANG Chunliu;ZHANG Jinyong;LEI Liwen(School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China;State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan 430070,China)

机构地区：[1]School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China [2]State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan 430070,China

出　　处：《Journal of Wuhan University of Technology(Materials Science)》2023年第3期514-519,共6页武汉理工大学学报（材料科学英文版）

基　　金：Funded by National Natural Science Foundation of China (No.43200021)。

摘　　要：The effects of particle size,gradation and solid loading of silicon nitride (Si_(3)N_(4)) on the rheological behavior and curing properties of ceramic slurry are studied by stereolithography (SLA).The results show that the particle size of Si_(3)N_(4) powder has a signif icant influence on the rheological properties and stability of the slurry.When m_(D50=1.3μm):m_(D50=2.3μm)=3:7,the slurry viscosity is low and the sedimentation is slow.The most important thing is that with the increase of the solid loading of the slurry,the viscosity of the slurry increases,the stability becomes higher,and the curing thickness decreases.The curing thickness of Si_(3)N_(4) ceramic slurry with solid loading of 50 vol% can reach nearly 50μm.The above results finally show that the process optimizes the formulation of the slurry in rheological and curing properties.

关 键 词：silicon nitride STEREOLITHOGRAPHY DISPERSION STABILITY 

分 类 号：TQ174.758.12[化学工程—陶瓷工业]